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Influence of copper nanowires on properties and microstructure of low-Ag Sn-1Ag-0.5Cu solders

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Abstract

In this paper, copper nanowires (Cu NWs) were mixed into the Sn1.0Ag0.5Cu solder to improve the properties of Sn1.0Ag0.5Cu solder and change the microstructure of Sn-1Ag-0.5Cu solder. The effects of adding Cu NWs on the formation and growth of interfacial intermetallic compounds (IMCs) between Sn1.0Ag0.5Cu-xCu NWs (x = 0, 0.05, 0.1, 0.2, 0.4, 0.8 wt%) (SAC105-xCu NWs) solders and Cu substrates were also studied. The experimental results showed that Cu NWs has few effects on the melting characteristics of Sn1.0Ag0.5Cu solder. However, it can improve the wettability of base solder to a certain degree and can effectively enhance the shear strength of the solder. It is also found that adding Cu NWs can refine the microstructure of SAC105-xCu NWs solder. In addition, the IMCs layer thickness of the SAC105-xCu NWs solders is smaller than that of plain Sn1.0Ag0.5Cu solder, which indicates that Cu NWs can effectively suppress IMC formation and growth.

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Acknowledgements

The present work was carried out with the support of Natural Science Foundation of Jiangsu Province of China (BK20211351), Postgraduate Research & Practice Innovation Program of Jiangsu Normal University (2020XKT189).

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Authors and Affiliations

  1. School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Zhi-Hao Li & Liang Zhang

  2. State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou, 450001, China

    Liang Zhang, Wei-Min Long, Su-Juan Zhong & Lei Zhang

  3. Shanghai Institute of Radio Equipment, Shanghai Institute, Shanghai, 200082, China

    Li-Li Gao

Authors
  1. Zhi-Hao Li
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  2. Liang Zhang
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  3. Li-Li Gao
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  4. Wei-Min Long
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  5. Su-Juan Zhong
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  6. Lei Zhang
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Contributions

Z-HL: Experiment, Writing—original draft preparation and data curation, LZ: Writing—reviewing and editing, L-LG, W-ML, S-JZ, LZ: Writing—reviewing and editing.

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Correspondence to Liang Zhang.

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Li, ZH., Zhang, L., Gao, LL. et al. Influence of copper nanowires on properties and microstructure of low-Ag Sn-1Ag-0.5Cu solders. J Mater Sci: Mater Electron 33, 7923–7932 (2022). https://doi.org/10.1007/s10854-022-07941-3

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  • DOI: https://doi.org/10.1007/s10854-022-07941-3

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