Abstract
Corrosion behavior of low-temperature sintered silver nanoparticle (AgNP) paste in NH4Cl solution was investigated using electrochemical measurements (electrochemical impedance, potentiodynamic polarization, and localized electrochemical impedance spectroscopy) as well as surface characterizations (scanning electron microscope and X-ray photoelectron spectroscopy). The thiazolyl derivative was first applied as the corrosion inhibitor for the sintered AgNP paste. Results showed that the corrosion rate increased with the rising NH4Cl concentration while it decreased with the increase of solution alkaline. Due to the formation of a protective film through the coordination of N and S with Ag atoms, 2-mercaptobenzothiazole and sodium 2-mercaptobenzothiazole both showed excellent corrosion inhibition efficiencies (more than 97%) for the sintered AgNP paste in NH4Cl solutions. Relevant mechanisms have been proposed.
Similar content being viewed by others
References
B. Liao, H. Wang, S. Wan, W. Xiao, X. Guo, Electrochemical migration inhibition of tin by disodium hydrogen phosphate in water drop test. Metals 10, 942 (2020)
X. Zhong, In situ study of the electrochemical migration of tin in the presence of H2S. J. Mater. Sci. 31, 8996–9005 (2020)
X. Zhong, S. Yu, L. Chen, J. Hu, Z. Zhang, Test methods for electrochemical migration: a review. J. Mater. Sci. 28, 2279–2289 (2017)
F. Li, V. Verdingovas, K. Dirscherl, G. Harsányi, R. Ambat, Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys. J. Mater. Sci. 31, 15308–15321 (2020)
A. Gharaibeh, I. Felhsi, Z. Keresztes, G. Harsányi, B. Journal, Electrochemical corrosion of SAC alloys: a review. Metals 10, 1276 (2020)
J. Kang, J. Tok, Z. Bao, Self-healing soft electronics. Nat. Electron. 2, 144–150 (2019)
J. Perelaer, R. Jani, M. Grouchko, A. Kamyshny, S. Magdassi, U. Schubert, Plasma and microwave flash sintering of a tailored silver nanoparticle ink, yielding 60% bulk conductivity on cost-effective polymer foils. Adv. Mater. 24, 3993–3998 (2012)
H. Ji, S. Wang, M. Li, J. Kim, Deep crystallization induced high thermal conductivity of low-temperature sintered Ag nanoparticles. Mater. Lett. 116, 219–222 (2014)
J. Liu, H. Chen, H. Ji, M. Li, Highly conductive Cu–Cu joint formation by low-temperature sintering of formic acid-treated Cu nanoparticles. ACS. Appl. Mater. Interface 8, 33289–33298 (2016)
R. Khazaka, L. Mendizabal, D. Henry, Review on joint shear strength of nano-silver paste and its long-term high temperature reliability. J. Electron. Mater. 43, 2459–2466 (2014)
H. Gong, F. Zhao, Y. Yao, Effect of Corrosion on Mechanical and Biological Properties of Nano-Silver Joints, in 20th International Conference on Electronic Packaging Technology(ICEPT). IEEE. 2019.
J. Li, C. Johnson, C. Buttay, W. Sabbah, S. Azzopardi, Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. J. Mater. Process. Tech. 215, 299–308 (2015)
S. Wang, M. Li, H. Ji, C. Wang, Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging. Scripta Mater. 69, 789–792 (2013)
B. Liao, H. Wang, W. Xiao, Y. Cai, X. Guo, Recent advances in method of suppressing dendrite formation of tin-based solder alloys. J. Mater. Sci. 31, 13001–13010 (2020)
K. Qi, X. Chen, G. Lu, Effect of interconnection area on shear strength of sintered joint with nano-silver paste. Solder. Surf. Mt. Tech. 20, 8–12 (2008)
G. Chen, Z. Zhang, Y. Mei, X. Li, D. Yu, L. Wang, X. Chen, Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint. Mech. Mater. 72, 61–71 (2014)
B. Liao, W. Jia, R. Sun, Z. Chen, X. Guo, Electrochemical migration behavior of Sn-3.0 Ag-05 Cu solder alloy under thin electrolyte layers. Surf. Rev. Lett. 26, 1850208 (2019)
M. Watanabe, S. Shinozaki, E. Toyoda, K. Asakura, T. Ichino, N. Kuwaki, Y. Higashi, T. Tanaka, Corrosion products formed on silver after a one-month exposure to urban atmospheres. Corrosion 62, 243–250 (2006)
L. Veleva, B. Valdez, G. Lopez, L. Vargas, J. Flores, Atmospheric corrosion of electro-electronics metals in urban desert simulated indoor environment. Corros. Eng. Sci. Technol. 43, 149–155 (2008)
S. Singh, S. Elumalai, A. Pal, Rain pH estimation based on the particulate matter pollutants and wet deposition study. Sci. Tatal. Environ. 563, 293–301 (2016)
S. Oh, Y. Kim, K. Jung, M. Park, M. Shon, H. Kwon, Galvanic corrosion behaviors of Cu connected to Au on a printed circuit board in ammonia solution. Met. Mater. Int. 24, 67–72 (2018)
B. Liao, H. Cen, Z. Chen, X. Guo, Corrosion behavior of Sn-3.0Ag-0.5Cu alloy under chlorine-containing thin electrolyte layers. Corros. Sci. 143, 347–361 (2018)
B. Liao, Z. Li, Y. Cai, X. Guo, Electrochemical migration behavior of Sn–3.0Ag–0.5Cu solder alloy under SO2 polluted thin electrolyte layers. J. Mater. Sci. 30, 5652–5661 (2019)
Q. Qu, C. Yan, L. Li, L. Zhang, G. Liu, C. Cao, Initial atmospheric corrosion of zinc in the presence of NH4Cl. Acta Metall. Sin. 17, 161–165 (2004)
E. Vernack, D. Costa, P. Tingaut, P. Marcus, DFT studies of 2-mercaptobenzothiazole and 2-mercaptobenzimidazole as corrosion inhibitors for copper. Corros. Sci. 174, 108840 (2020)
X. Wu, F. Wiame, V. Maurice, P. Marcus, Moiré structure of the 2-mercaptobenzothiazole corrosion inhibitor adsorbed on a (111)-oriented copper surface. J. Phys. Chem. C 124, 15995–16001 (2020)
S. Sharma, V. Maurice, L. Klein, P. Marcus, Local inhibition by 2-mercaptobenzothiazole of early stage intergranular corrosion of copper. J. Electrochem. Soc. 167, 161504 (2020)
X. Wu, F. Wiame, V. Maurice, P. Marcus, Adsorption and thermal stability of 2-mercaptobenzothiazole corrosion inhibitor on metallic and pre-oxidized Cu(111) model surfaces. Appl. Surf. Sci. 508, 145132 (2020)
M. Finšgar, D. Merl, An electrochemical, long-term immersion, and XPS study of 2-mercaptobenzothiazole as a copper corrosion inhibitor in chloride solution. Corros. Sci. 83, 164–175 (2014)
P. Spurgeon, D. Liu, H. Walen, J. Oh, H. Yang, Y. Kim, P. Thiel, Characteristics of sulfur atoms adsorbed on Ag(100), Ag(110), and Ag(111) as probed with scanning tunneling microscopy: experiment and theory. Phys. Chem. Chem Phys. 21, 10540–10551 (2019)
S. Russell, M. Shen, D. Liu, P. Thiel, Adsorption of sulfur on Ag(100). Surf. Sci. 605, 520–527 (2011)
F. Yang, B. Hu, Y. Peng, C. Hang, H. Chen, C. Lee, J. Wei, M. Li, Ag Microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications. J. Mater. Sci. 30, 5526–5535 (2019)
G. Liu, Y. Zhang, M. Wu, R. Huang, B. Materials, Study of depassivation of carbon steel in simulated concrete pore solution using different equivalent circuits. Constr. Build. Mater. 157, 357–362 (2017)
H. Kim, Corrosion process of silver in environments containing 0.1 ppm H2S and 1.2 ppm NO2. Mater. Corros. 54, 243–250 (2015)
C. Wagner, D. Zatko, R. Raymond, Use of the oxygen KLL auger lines in identification of surface chemical states by electron spectroscopy for chemical analysis. Anal. Chem. 52, 1445–1451 (1980)
J. Elechiguerra, L. Larios-Lopez, C. Liu, D. Garcia-Gutierrez, M. Yacaman, Corrosion at the nanoscale: the case of silver nanowires and nanoparticles. Chem. Mater. 17, 6042–6052 (2005)
M. Zharnikov, M. Grunze, Spectroscopic characterization of thiol-derived self-assembling monolayers. J. Phys. 13, 11333 (2001)
L. Kazansky, I. Selyaninov, Y. Kuznetsov, Adsorption of 2-mercaptobenzothiazole on copper surface from phosphate solutions. Appl. Surf. Sci. 258, 6807–6813 (2012)
Z. Zhang, Q. Wang, X. Wang, L. Gao, The influence of crystal faces on corrosion behavior of copper surface: first-principle and experiment study. Appl. Surf. Sci. 396, 746–753 (2017)
G. Hope, K. Watling, R. Woods, An electrochemical investigation of the suppression of silver dissolution in aqueous cyanide by 2-mercaptobenzothiazole. J. Appl. Electrochem. 31, 703–709 (2001)
Acknowledgements
This work supported by the National Natural Science Foundation of China (Grant nos. 52001080, 51971067), Platform Research Capability Enhancement Project of Guangzhou University (Grant no. 69-620939), Guangzhou University’s 2020 Training Program for Talent (Grant no. 69-62091109), Provincial Innovation Training Program for College Students of Guangzhou University (Grant no. S202011078017), and Science and Technology Research Project of Guangzhou (Grant no. 202002010007).
Author information
Authors and Affiliations
Corresponding authors
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Wang, H., Quan, X., Zeng, Q. et al. Electrochemical corrosion and protection of low-temperature sintered silver nanoparticle paste in NH4Cl solution. J Mater Sci: Mater Electron 32, 13748–13760 (2021). https://doi.org/10.1007/s10854-021-05952-0
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-021-05952-0