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Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys

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Abstract

Sn–Ag–Cu solder alloys were usually modified using trace elements to achieve various properties. This paper investigated the effect of additives of Ni, Bi, and Sb on the microstructure and corrosion behavior of SAC alloys under application condition. Investigation was carried out using both solder alloy ingots and reflow-soldered surface insulation resistance interdigitated patterns by electrochemical methods under humid and corrosive conditions. Microstructure analysis was performed using X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy etc. Volta potential distribution in the bulk of the alloy was analyzed by Scanning Kelvin Probe Force Microscopy. Results show the passivation domain of five tested solder alloys did not influence the susceptibility of electrochemical migration under 5 V DC bias loading. Ni and Bi additives resulted in lower susceptibility of electrochemical migration due to homogeneity of the IMCs distribution in the bulk alloys. Bi precipitates in InnoLot alloy participated micro-galvanic corrosion as cathode rather than Ag containing phase as known before.

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Acknowledgements

The present research work was carried out as a part of work in CELCORR/CreCon consortium (www.celcorr.com). The authors would like to acknowledge the CELCORR/CreCon consortium for the funding support. Dr. Bálint Medgyes and Dr. Gábor Harsányi would like to thank the Pro Progressio Foundation (Hungary) for the financial support. Special thanks to BME for the material manufacturing process and Dr. Kai Dirscherl from DFM assisted the SKPFM analysis.

Funding

The project is funded by CELCORR/CreCon consortium (www.celcorr.com).

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Authors and Affiliations

  1. Section of Materials and Surface Engineering, Department of Mechanical Engineering, Technical University of Denmark, 2800, Kgs. Lyngby, Denmark

    Feng Li, Vadimas Verdingovas & Rajan Ambat

  2. Danish National Metrology Institute, Kogle Allé 5, 2970, Hørsholm, Denmark

    Kai Dirscherl

  3. Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, 1111, Hungary

    Gábor Harsányi & Bálint Medgyes

Authors
  1. Feng Li
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  2. Vadimas Verdingovas
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  3. Kai Dirscherl
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  4. Gábor Harsányi
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  5. Bálint Medgyes
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  6. Rajan Ambat
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Contributions

All the testing experiments were conducted by FL and Dr. VV in Technical University of Denmark under supervisor of Prof. RA; Dr. KD in Danish National Metrology Institute provided the support of Volta potential mapping; BM and GH in Budapest University of Technology and Economics provided the support of material preparation and fabrication of the test boards.

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Correspondence to Feng Li.

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Li, F., Verdingovas, V., Dirscherl, K. et al. Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys. J Mater Sci: Mater Electron 31, 15308–15321 (2020). https://doi.org/10.1007/s10854-020-04095-y

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  • DOI: https://doi.org/10.1007/s10854-020-04095-y

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