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Effects of Silver and Antimony Content in Lead-Free High-Temperature Solders of Bi-Ag and Bi-Sb on Copper Substrate

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Abstract

Replacing high-temperature leaded solders with lead-free alternatives is an important issue in the electronics industry. This study investigates the viability of lead-free Bi-Ag and Bi-Sb solder alloys, ranging in composition from 1.5 to 5 wt.% Ag and Sb. The effects of melting point, wetting angle, microstructure, and morphology were analysed by differential scanning calorimetry, optical microscopy, and scanning electron microscope–energy dispersive x-ray analysis. The results showed that all tested alloys had suitable melting temperatures, ranging from 271 to 276°C. The wetting angle increased by raising the Sb content, but, in contrast, by increasing the wt.% of Ag, the wetting angle decreased. A Cu-rich phase was present in all Bi-Ag alloys, The Cu-rich phase was also present in decreasing amounts with increasing Sb, but, with 5Sb, there was no Cu-rich phase, and a Cu3Sb intermetallic compound was present in the interface and as precipitates in the solder. Grooving along Cu grain boundaries was observed at the interface for the rest of the alloys.

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Authors and Affiliations

  1. Department of Mechanical and Manufacturing Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400, Serdang, Selangor, Malaysia

    M. Nahavandi, M. A. Azmah Hanim, Z. N. Ismarrubie, A. Hajalilou, R. Rohaizuan & M. Z. Shahrul Fadzli

  2. Institute of Tropical Forestry and Forest Products, Universiti Putra Malaysia, 43400, Serdang, Selangor, Malaysia

    M. A. Azmah Hanim

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  1. M. Nahavandi
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  2. M. A. Azmah Hanim
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  3. Z. N. Ismarrubie
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  4. A. Hajalilou
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  5. R. Rohaizuan
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  6. M. Z. Shahrul Fadzli
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Correspondence to M. Nahavandi.

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Nahavandi, M., Hanim, M.A.A., Ismarrubie, Z.N. et al. Effects of Silver and Antimony Content in Lead-Free High-Temperature Solders of Bi-Ag and Bi-Sb on Copper Substrate. J. Electron. Mater. 43, 579–585 (2014). https://doi.org/10.1007/s11664-013-2873-8

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  • DOI: https://doi.org/10.1007/s11664-013-2873-8

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