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Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

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Abstract

This study investigated the effect of Ti content on microstructure and mechanical properties of the high temperature Pb-free solder Zn25SnxTi (x = 0–0.06). The SEM microstructure images show that the addition of Ti refined the grain size of the Zn-rich phases. It was evident that the addition of Ti tends to refine the grain size of the Zn-rich phase at the eutectic structure. The ultimate tensile strength, elongation, and toughness of the alloys were investigated with respect to Ti addition. The Zn25Sn0.02Ti exhibits the largest elongation and the best toughness among all the solders investigated. The microstructure and the fractograph of the alloys show the formation of ternary Ti–Sn–Zn compounds at the addition of 0.03%Ti and above. The variation in toughness with respect to Ti content was ascribed to the combination effect of grain refining and the formation of the intermetallic compound.

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Acknowledgements

The authors appreciate the financial support of this study by the Ministry of Science and Technology, Republic of China (Taiwan) under MOST 104-2221-E-006-029-MY3.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, 70101, Taiwan, Republic of China

    Che-Wei Chang & Kwang-Lung Lin

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  1. Che-Wei Chang
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  2. Kwang-Lung Lin
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Correspondence to Che-Wei Chang.

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Chang, CW., Lin, KL. Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi. J Mater Sci: Mater Electron 29, 10962–10968 (2018). https://doi.org/10.1007/s10854-018-9176-z

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  • DOI: https://doi.org/10.1007/s10854-018-9176-z

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