Skip to main content
SpringerLink
Log in

Effects of minor Bi, Ni on the wetting properties, microstructures, and shear properties of Sn–0.7Cu lead-free solder joints

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

In present study, minor addition of Bi and Ni were added with Sn–0.7Cu eutectic solder to investigate the effect of exotic elements on the wetting properties, microstructures as well as shear properties of the newly developed solder alloys. Wetting balance results show that the addition of 3.5 wt% Bi increased the maximum wetting force and lowered the wetting time, while 0.01 and 0.03 wt% Ni resulted in the decline of wetting force. The microstructural evolution of four types of solder/Cu joints indicate that the present of Bi suppressed the growth of Cu3Sn phase after one time reflow and ten times reflows. This inhibiting effect was reduced with the segregation of Bi-rich phase. Besides, 0.03 wt% Ni additive caused the absence of Cu3Sn phase upon one time reflow, ten times reflows and aging for 750 h. According to shear strength test, Bi elements enhanced the shear strength of Sn–Cu based solder/Cu joints due to the solution strengthening. This effect was reduced with the precipitation of Bi-rich phase, which weakened the shear-bearing ability of solder joints.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9

Similar content being viewed by others

References

  1. K. Zeng, K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002)

    Article  Google Scholar 

  2. H.T. Ma, C. Jeffrey, C. Suhling, J. Mater. Sci. 44, 1141 (2009)

    Article  Google Scholar 

  3. A.E. Hammad, A.M. El-raher, J. Electon. Mater. 43, 4146 (2014)

    Article  Google Scholar 

  4. J.C. Gong, C. Liu, P.P. Conway, V.V. Silberschmidt, Acta Mater. 56, 4291 (2008)

    Article  Google Scholar 

  5. L. Zhang, C.W. He, Y.H. Guo, J.G. Han, Y.W. Zhang, X.Y. Wang, Microelectron. Reliab. 52, 559 (2012)

    Article  Google Scholar 

  6. S. Yagi, T. Ichitsubo, E. Matsubara, M. Yamaguchi, H. Kimura, K. Sasamori, J. Alloys Compd. 484, 185 (2009)

    Article  Google Scholar 

  7. J.F. Li, S.H. Mannan, M.P. Clode, K. Chen, D.C. Whalley, C. Liu, D.A. Hutt, Acta Mater. 55, 737 (2007)

    Article  Google Scholar 

  8. A.A. EI-Daly, F. EI-Tantawy, A.E. Hammad, M.S. Gaafar, E.H. EI-Mossalamy, A.A. Al-Ghamdi, J. Alloys Compd. 509, 7238 (2011)

    Article  Google Scholar 

  9. P. Šebo, P. Švec, D. Janičkovič, Mater. Sci. Eng. A 528, 5955 (2011)

    Article  Google Scholar 

  10. J.W. Yoon, B.I. Noh, B.K. Kim, C.C. Shur, S.B. Jung, J. Alloys Compd. 486, 142 (2009)

    Article  Google Scholar 

  11. E.S. Freitas, W.R. Osório, J.E. Spinelli, A. Garcia, Microelectron. Reliab. 54, 1392 (2014)

    Article  Google Scholar 

  12. M.J. Rizvi, Y.C. Chan, C. Bailey, H. Lu, M.N. Islam, J. Alloys Compd. 407, 208 (2006)

    Article  Google Scholar 

  13. J. Zhou, Y. Sun, F. Xue, J. Alloys Compd. 397, 260 (2005)

    Article  Google Scholar 

  14. A.K. Gain, Y.C. Chan, K.C. Yung, Mater. Sci. Eng. B 162, 92 (2009)

    Article  Google Scholar 

  15. J.Y. Park, C.S. Kang, J.P. Jung, J. Electon. Mater. 28, 1256 (1999)

    Article  Google Scholar 

  16. A. Mulugeta, S. Guna, Mater. Sci. Eng. R 27, 95 (2000)

    Article  Google Scholar 

  17. H. Yu, V. Vuorinen, J.K. Kivilahti, In The Proceedings of the 2006 IEEE/EIA CPMT Electronic Component and Technology Conference (ECTC’06), San Diego, CA, USA, May 29–June 1 2006

  18. Y.W. Lin, K.L. Lin, J. Appl. Phys. 108, 063536 (2010)

    Article  Google Scholar 

  19. T.Y. Kang, Y.Y. Xiu, C.Z. Liu, L. Hui, J.J. Wang, W.P. Tong, J. Alloys Compd. 509, 1785 (2011)

    Article  Google Scholar 

  20. H.K. Kim, K.N. Tu, Phys. Rev. B 53, 16027 (1996)

    Article  Google Scholar 

  21. D. Ma, W.D. Wang, S.K. Lahiri, J. Appl. Phys. 91, 3312 (2002)

    Article  Google Scholar 

  22. T. Laruila, V. Vuorinen, M. Paulasto-Kröckel, Mater. Sci. Eng. R 68, 1 (2010)

    Article  Google Scholar 

  23. K. Nogita, Intermetallics 18, 145 (2010)

    Article  Google Scholar 

  24. T. Laruila, V. Vuorinen, J.K. Kivilahti, Mater. Sci. Eng. R 49, 1 (2005)

    Article  Google Scholar 

Download references

Acknowledgments

The projects are financially supported by a Natural Science Foundation of China (Grant No. 51375511) and Fundamental Research Funds for the Central Universities of China (Grant Nos. CDJZR12138801, CDJZR14130008 and CDJZR13130033).

Author information

Authors and Affiliations

  1. College of Materials Science and Engineering, Chongqing University, Chongqing, 40044, China

    Jun Shen, Yayun Pu, Dong Wu & Qin Tang

  2. Institut des Sciences Moléculaires d’ Orsay, CNRS, Bâtiment 210, Université Paris-Sud, 91405, Orsay, France

    Mali Zhao

Authors
  1. Jun Shen
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Yayun Pu
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Dong Wu
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Qin Tang
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Mali Zhao
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jun Shen.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Shen, J., Pu, Y., Wu, D. et al. Effects of minor Bi, Ni on the wetting properties, microstructures, and shear properties of Sn–0.7Cu lead-free solder joints. J Mater Sci: Mater Electron 26, 1572–1580 (2015). https://doi.org/10.1007/s10854-014-2577-8

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-014-2577-8

Keywords

Search

Navigation