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Understanding the mechanism of ultrasonic vibration-assisted drilling (UVAD) for micro-hole formation on silicon wafers using numerical and analytical techniques

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Abstract

This study investigated the mechanism of UVAD using numerical and analytical techniques. Silicon wafers possess challenging cutting properties due to their inherent brittleness and susceptibility to cracking along specific crystal orientation. Hence, non-traditional cutting methods like UVAD hold promise for precision micro-hole drilling in silicon wafers. In order to comprehend the mechanism of UVAD, the numerical technique utilized a direct brittle micro-cracking model within a 2D finite element (FE) method. This facilitated a comparative analysis between conventional drilling (CD) and UVAD, with a specific focus on understanding the micro-cracking mechanisms during the mechanical process. This study examined primarily the cutting force, micro-fracture analysis, and cutting energy. The numerical technique effectively predicted micro-cracks within the brittle regime, a task that is challenging to accomplish using analytical methods alone. In parallel, an analytical technique was developed to predict brittle-ductile transition (BDT) lines by analyzing the thrust force and specific cutting energy (SCE), combined with the numerical technique. Various feed rates per revolution were tested to validate the analytical force predictions. The analytical results demonstrate that the force profile corresponds to the transient cutting depth, while the numerical results indicated that the direct brittle micro-cracking model effectively demonstrated the fracture mechanisms, particularly at greater depths of cut. The SCE graph can predict the formation of a ductile regime on the cutting surface of the drilled micro-hole, although predicting micro-fractures on the side edges of the drilled micro-holes remains challenging. Additionally, UVAD demonstrated a reduction in micro-fractures on the sides of drilled micro-holes, particularly at very low feed rates per revolution.

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The material and data availability are obtainable as inquired to the first author and corresponding authors.

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The numerical and MATLAB codes are available as inquired permission to the first author and corresponding authors.

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Funding

This research was funded by the Ministry of Science and ICT (MSIT) through the Korea Electrotechnology Research Institute’s (KERI) primary research program through the National Research Council of Science and Technology (NST) in 2023. (No. 23A01021). In addition, this work was supported by the National Research Foundation of Korea(NRF) grant funded by the Korean government(MSIT) (RS-2023–00278890).

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Authors and Affiliations

  1. Precision Machining Laboratory Room 214, Department of Mechanical Engineering, Yeungnam University, 280 Daehak-Ro, Gyeongsan-Si, Gyeongbuk-Do, South Korea

    Rendi Kurniawan, Shuo Chen, Hanwei Teng, Jielin Chen, Saood Ali & Tae Jo Ko

  2. Electric Machines and Drives Research Center, Korea Electrotechnology Research Institute, 12 Jeongiui-GilSeongsan-Gu, Chanwon-Si, Gyeongsangnam-Do, 51543, South Korea

    Pil-Wan Han

  3. Department of Mechanical Engineering, Universitas Indonesia, Kampus Baru UI, Depok, 16424, Indonesia

    Rendi Kurniawan & Gandjar Kiswanto

  4. Department of Mechanical Engineering, PSG Institute of Technology and Applied Research, Neelambur, Coimbatore, 641062, Tamil Nadu, India

    Sundaresan Thirumalai Kumaran

  5. School of Mechanical Engineering and Automation, Wuhan Textile University, Wuhan, 430071, Hubei, China

    Moran Xu

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  1. Rendi Kurniawan
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Contributions

Rendi Kurniawan: writing—original draft, supervision, methodology, and software. Chen Shou: formal analysis, investigation, and data curation. Moran Xu: conceptualization and visualization. Hanwei Teng: investigation and data curation. Jielin Chen: investigation and data curation. Saood Ali: investigation and validation. Pil-Wan Han: funding acquisition and resources. Gandjar Kiswanto: writing—review and editing. Sundaresan Thirumalai Kumaran: writing—review and editing. Tae Jo Ko: writing—review and editing and funding acquisition.

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Correspondence to Shuo Chen, Moran Xu or Tae Jo Ko.

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Kurniawan, R., Chen, S., Xu, M. et al. Understanding the mechanism of ultrasonic vibration-assisted drilling (UVAD) for micro-hole formation on silicon wafers using numerical and analytical techniques. Int J Adv Manuf Technol 132, 1283–1313 (2024). https://doi.org/10.1007/s00170-024-13412-2

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