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Finite element analysis of the effect of tool rake angle on brittle-to-ductile transition in diamond cutting of silicon

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Abstract

Brittle-to-ductile transition plays a crucial role in ultra-precision machining of hard-brittle materials. In the present work, we investigate the brittle-to-ductile transition in diamond grooving of monocrystalline silicon by finite element modeling and simulation based on Drucker-Prager constitutive model. The brittle-to-ductile transition behavior is distinguished by analyzing evolutions of chip profile and cutting force. Corresponding diamond grooving experiment using the same machining configuration with the finite element simulation is also carried out to derive the critical depth of cut for the brittle-to-ductile transition. The comparison of experimental value of the critical depth of cut and predicted one by the finite element simulation demonstrates the high accuracy of as-established finite element model. Subsequent finite element simulations are performed to investigate the influence of rake angle of cutting tool on both diamond grooving and conventional diamond cutting with a constant depth of cut, which demonstrates a prominent dependence of brittle-to-ductile transition of silicon on the rake angle ranging from − 60° to 0°. And a critical rake angle for the most pronounced ductile machinability of silicon is found.

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References

  1. Rajendra S (2009) Why silicon is and will remain the dominant photovoltaic material. J Nanophotonics 3:032503

    Article  MathSciNet  Google Scholar 

  2. Saoubi RM, Outeiro JC, Chandrasekaran H, Dillon OW, Jawahir IS (2008) A review of surface integrity in machining and its impact on functional performance and life of machined products. Int J Sustain Manuf 1:203–236

    Article  Google Scholar 

  3. Chon KS, Namba Y (2010) Single-point diamond turning of electroless nickel for flat X-ray mirror. J Mech Sci Technol 24:1603–1609

    Article  Google Scholar 

  4. Higginbottom DB, Campbell GT, Araneda G, Fang FZ, Colombe Y, Buchler BC, Lam PK (2018) Fabrication of precision hemispherical mirrors for quantum optics applications. Sci Rep 8:221

    Article  Google Scholar 

  5. Gilman JJ (1993) Why silicon is hard. Science 261:1436–1439

    Article  Google Scholar 

  6. Arif M, Rahman M, San WY (2012) A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries. Int J Adv Manuf Technol 63:481–504

    Article  Google Scholar 

  7. Chen YL, Cai Y, Shimizu Y, Ito S, Gao W, Ju BF (2016) Ductile cutting of silicon microstructures with surface inclination measurement and compensation by using a force sensor integrated single point diamond tool. J Micromech Microeng 26:025002

    Article  Google Scholar 

  8. Liu K, Zuo D, Li XP, Rahman M (2009) Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools. J Vac Sci Technol B 27:1361–1366

    Article  Google Scholar 

  9. Zhou M, Ngoi BKA, Zhong ZW, Chin CS (2001) Brittle-ductile transition in diamond cutting of silicon single crystals. Mater Manuf Process 16:14

    Google Scholar 

  10. Uddin MS, Seah KHW, Rahman M, Li XP, Liu K (2007) Performance of single crystal diamond tools in ductile mode cutting of silicon. J Mater Process Technol 185:24–30

    Article  Google Scholar 

  11. Leung TP, Lee WB, Lu XM (1998) Diamond turning of silicon substrates in ductile-regime. J Mater Process Technol 73:42–48

    Article  Google Scholar 

  12. Blake PN, Scattergood RO (1990) Ductile-regime machining of germanium and silicon. J Am Ceram Soc 73:9

    Article  Google Scholar 

  13. Chao CL, Ma KJ, Liu DS, Bai CY, Shy TL (2002) Ductile behaviour in single-point diamond-turning of single-crystal silicon. J Mater Process Technol 127:87–190

    Article  Google Scholar 

  14. Yan J, Syoji K, Kuriyagawa T, Suzuki H (2002) Ductile regime turning at large tool feed. J Mater Process Technol 121:63–372

    Article  Google Scholar 

  15. Shibata T, Fujii S, Makino E, Ikeda M (1996) Ductile-regime turning mechanism of single-crystal silicon. Precis Eng 18:29–137

    Article  Google Scholar 

  16. Fang FZ, Venkatesh VC (1998) Diamond cutting of silicon with nanometric finish. Cirp Ann Manuf Technol 47:5–49

    Article  Google Scholar 

  17. Wu C, Li B, Yang J, Liang S (2016) Prediction of grinding force for brittle materials considering co-existing of ductility and brittleness. Int J Adv Manuf Technol 87:1967–1975

    Article  Google Scholar 

  18. Yan JW, Tamaki J, Syoji K (2004) Single-point diamond turning of CaF2 for nanometric surface. Int J Adv Manuf Technol 24:640–646

    Article  Google Scholar 

  19. Uddin MS, Seah KHW, Rahman M, Li XP, Liu K (2007) Performance of single crystal diamond tools in ductile mode cutting of silicon. J Mater Process Technol 185:4–30

    Article  Google Scholar 

  20. Patten JA, Gao W (2001) Extreme negative rake angle technique for single point diamond nano-cutting of silicon. Precis Eng 25:65–167

    Article  Google Scholar 

  21. Zhang ZY, Du Y, Wang B, Wang Z, Kang RK, Guo D (2017) Nanoscale wear layers on silicon wafers induced by mechanical chemical grinding. Tribol Lett 65:132

    Article  Google Scholar 

  22. Zhang ZY, Cui JF, Wang B, Wang Z, Kang RK, Guo DM (2017) A novel approach of mechanical chemical grinding. J Alloys Compd 726:14–524

    Google Scholar 

  23. Xiao G, To S, Zhang G (2015) Molecular dynamics modelling of brittle-ductile cutting mode transition: case study on silicon carbide. Int J Mach Tool Manu 88:14–222

    Article  Google Scholar 

  24. Zhang JG, Suzuki N, Wang YL, Shamoto E (2014) Fundamental investigation of ultra-precision ductile machining of tungsten carbide by applying elliptical vibration cutting with single crystal diamond. J Mater Process Technol 214:644–2659

    Google Scholar 

  25. Liu K, Li XP, Liang SY (2007) The mechanism of ductile chip formation in cutting of brittle materials. Int J Adv Manuf Technol 33:75–884

    Article  Google Scholar 

  26. Yang TS, Chang SY, Chou JC (2012) Predictions of scratch characters for engineering material by using fem and abductive network. Appl Mech Mater 232:59–664

    Google Scholar 

  27. Zhang ZY, Guo DM, Wang B, Kang RK, Zhang B (2015) A novel approach of high speed scratching on silicon wafers at nanoscale depths of cut. Sci Report 5:16395

    Article  Google Scholar 

  28. Wang B, Zhang ZY, Chang KK, Cui JF, Andreas R, Yu JH, Lin CT, Chen GX, Zang KT, Luo J, Guo DM (2018) New deformation-induced nanostructure in silicon. Nano Lett 18:4611–4617

    Article  Google Scholar 

  29. Yan JW, Zhao HW, Kuriyagawa T (2009) Effects of tool edge radius on ductile machining of silicon: an investigation by fem. Semicond Sci Technol 24:075018

    Article  Google Scholar 

  30. Mir A, Luo XC, Cheng K, Cox A (2017) Investigation of influence of tool rake angle in single point diamond turning of silicon. Int J Adv Manuf Technol 94:2343–2355

    Article  Google Scholar 

  31. Shi LQ, Li XW, Yu F (2013) Finite element simulation of precision cutting monocrystalline silicon. Adv Mater Res 662:99–102

    Article  Google Scholar 

  32. Liu HT, Xie WK, Sun YZ, Zhu XF, Wang MH (2017) Investigations on brittle-ductile cutting transition and crack formation in diamond cutting of mono-crystalline silicon. Int J Adv Manuf Technol 95:9–10

    Google Scholar 

  33. Wang SF, An CH, Zhang FH, Wang J, Lei XY, Zhang JF (2016) An experimental and theoretical investigation on the brittle ductile transition and cutting force anisotropy in cutting KDP crystal. Int J Mach Tool Manu 106:98–108

    Article  Google Scholar 

  34. Lee SH, Ahn BW (2006) Monitoring of brittle-ductile transition during AFM machining using acoustic emission. Key Eng Mater 326–328:405–408

    Article  Google Scholar 

  35. Koshimizu S, Otsuka J (2001) Detection of ductile to brittle transition in microindentation and microscratching of single crystal silicon using acoustic emission. Mach Sci Technol 5:101–114

    Article  Google Scholar 

  36. Youn SW, Kang CG (2005) FEA study on nanodeformation behaviors of amorphous silicon and borosilicate considering tip geometry for pit array fabrication. Mater Sci Eng 390:233–239

    Article  Google Scholar 

  37. Blaedel KL, Carr JW, Davis PJ, Goodman WA, Haack JK, Krulewich D (2001) An empirical survey on the influence of machining parameters on tool wear in diamond turning of large single-crystal silicon optics. Precis Eng 25:247–257

    Article  Google Scholar 

  38. Fang FZ, Zhang GX (2003) An experimental study of edge radius effect on cutting single crystal silicon. Int J Adv Manuf Technol 22:703–707

    Article  Google Scholar 

  39. Zhao QL, Chen MJ, Liang YC, Dong S, Deng C (2002) Effects of diamond cutting tool’s rake angle and rounded cutting edge radius on the machined single crystal silicon surface quality. J Mech Eng-en 12:54–59

    Article  Google Scholar 

  40. Durazo-Cardenas I, Shore P, Luo XC, Jacklin T, Impey SA, Cox A (2007) 3D characterisation of tool wear whilst diamond turning silicon. Wear 262:340–349

    Article  Google Scholar 

  41. Wang MH, Wang W, Lu ZS (2013) Critical cutting thickness in ultra-precision machining of single crystal silicon. Int J Adv Manuf Technol 65:843–851

    Article  Google Scholar 

  42. Mir A, Luo XC, Siddiq A (2017) Smooth particle hydrodynamics study of surface defect machining for diamond turning of silicon. Int J Adv Manuf Technol 88:2461–2476

    Article  Google Scholar 

  43. Ando T, Sato K, Shikida M, Yoshioka T, Yoshikawa Y, Kawabata T (1997) Orientation-dependent fracture strain in single-crystal silicon beams under uniaxial tensile conditions. Proc IEEE Int Symp Micromechatronics Hum Sci:55–60

  44. Zhang JJ, Zhang JG, Wang ZF, Hartmaier A, Yan Y, Sun T (2017) Interaction between phase transformations and dislocations at incipient plasticity of monocrystalline silicon under nanoindentation. Comput Mater Sci 131:55–61

    Article  Google Scholar 

  45. Zhu B, Zhao D, Zhao HW, Guan J, Hou PL, Wang SB, Qian L (2017) A study on the surface quality and brittle-ductile transition during the elliptical vibration-assisted nanocutting process on monocrystalline silicon via molecular dynamic simulations. RSC Adv 7:4179–4189

    Article  Google Scholar 

  46. Ravindra D, Ghantasala MK, Patten J (2012) Ductile mode material removal and high-pressure phase transformation in silicon during micro-laser assisted machining. Precis Eng 36:364–367

    Article  Google Scholar 

  47. Zhang ZB, Stukowski A, Urbassek HM (2016) Interplay of dislocation-based plasticity and phase transformation during Si nanoindentation. Comput Mater Sci 119:82–89

    Article  Google Scholar 

  48. Callahan DL, Morris JC (1992) The extent of phase transformation in silicon hardness indentations. J Mater Res 7:1614–1617

    Article  Google Scholar 

  49. Cai MB, Li XP, Rahman M (2007) High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer. P I Mech Eng B-J Eng 221:1511–1519

    Google Scholar 

  50. Yan J, Asami T, Harada H, Kuriyagawa T (2009) Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining. Precis Eng 33:378–386

    Article  Google Scholar 

  51. Zhang ZY, Wang B, Kang RK, Zhang B, Guo DM (2015) Changes in surface layer of silicon wafers from diamond scratching. CIRP Ann Manuf Technol 64:349–352

    Article  Google Scholar 

Download references

Funding

This work was financially supported by the National Natural Science Foundation of China (NSFC)-German Research Foundation (DFG) international joint research program (51761135106), the Science Challenge Project (Nos. TZ2018006-0201-02 and TZ2018006-0205-02), the Foundation of Laboratory of Ultra Precision Manufacturing Technology, CAEP (ZD 18007), and the Fundamental Research Funds for the Central Universities and Open Research Foundation of State Key Laboratory of Digital Manufacturing Equipment and Technology in Huazhong University of Science and Technology, China (DMETKF2018007 and DMETKF2019016).

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Authors and Affiliations

  1. Center for Precision Engineering, Harbin Institute of Technology, Harbin, 150001, China

    Junjie Zhang, La Han, Yongda Yan & Tao Sun

  2. State Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China

    Jianguo Zhang & Jianfeng Xu

  3. Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang, 621900, China

    Guo Li

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  1. Junjie Zhang
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  2. La Han
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  3. Jianguo Zhang
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  4. Guo Li
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  7. Tao Sun
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Correspondence to Junjie Zhang or Jianguo Zhang.

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Zhang, J., Han, L., Zhang, J. et al. Finite element analysis of the effect of tool rake angle on brittle-to-ductile transition in diamond cutting of silicon. Int J Adv Manuf Technol 104, 881–891 (2019). https://doi.org/10.1007/s00170-019-03888-8

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  • DOI: https://doi.org/10.1007/s00170-019-03888-8

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