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Study on material removal mechanism of photocatalytic-assisted electrochemical milling-grinding SiCp/Al

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Abstract

Silicon carbide–reinforced aluminum matrix composites (SiCp/Al) are widely used in aviation, automobile, electronics, and many other fields due to their excellent comprehensive material properties. However, traditional processing technology faces severe challenges. This paper proposed a novel hybrid processing method of SiCp/Al materials, photocatalytic-assisted electrochemical milling-grinding (PAECMG). In this method, the photocatalytic reaction layer on the surface of insoluble SiC particles is removed by repeated grinding. The removal mechanism of anode material SiCp/Al in the PAECMG process was studied in detail by experiments. The abrasive tool destroys the passivation layer on the workpiece’s surface to accelerate the aluminum matrix’s anodic dissolution. Moreover, the SiC-reinforced particles are repeatedly and alternately removed by photocatalytic reaction and grinding mechanical action. Microscopic surface contrast analysis demonstrated that PAECMG could simultaneously remove metal aluminum matrix and silicon carbide particles. Comparing current waveforms during machining shows that PAECMG can improve machining stability. Based on the detailed analysis of the material removal phenomenon, a qualitative model of the material removal mechanism of PAECMG was established. This study provides valuable insights into the material removal mechanism in the combined photocatalytic-assisted ECM and mechanical grinding process.

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Data availability

The datasets used or analyzed during the current study are available from the corresponding author on reasonable request.

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Funding

This research is financially supported by the National Natural Science Foundation of China (Grant no. 52075334) and the NSFC Key Project for International Collaboration (Grant no. 51961135201).

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Authors and Affiliations

  1. School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China

    Feng Wang, Jing Zhou, Siyi Wu, Xiaoming Kang & Wansheng Zhao

  2. State Key Laboratory of Mechanical System and Vibration, Shanghai, China

    Feng Wang, Jing Zhou, Siyi Wu, Xiaoming Kang & Wansheng Zhao

Authors
  1. Feng Wang
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  2. Jing Zhou
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  3. Siyi Wu
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  4. Xiaoming Kang
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Contributions

Feng Wang: conceptualization, methodology, validation, formal analysis, and writing—original draft and editing. Siyi Wu: formal analysis and validation. Jing Zhou: formal analysis and validation. Xiaoming Kang: funding acquisition, supervision, and writing—reviewing and editing. Wan-Sheng Zhao: funding acquisition, supervision, and writing—reviewing and editing.

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Correspondence to Xiaoming Kang.

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Wang, F., Zhou, J., Wu, S. et al. Study on material removal mechanism of photocatalytic-assisted electrochemical milling-grinding SiCp/Al. Int J Adv Manuf Technol 124, 817–832 (2023). https://doi.org/10.1007/s00170-022-10539-y

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  • DOI: https://doi.org/10.1007/s00170-022-10539-y

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