Abstract
Ag sinter-joining is an ideal connection technique for next-generation power electronics packaging due to its excellent high-temperature stability and excellent thermal conductivity. In this work, we applied Ag sinter-joining to die attach of power electronics and focused reliability of Ag sinter-joining under a harsh thermal cycling condition, which ranges from − 50 to 250 ℃. The bonding quality of as-sintered die attach had a shear strength of over 45 MPa and remained over 25 MPa after a 500-cycle test. However, the shear strength drastically degraded to less than 10 MPa due to a failure of metallization layer detachment between dummy chip and sputtering layer after 750 cycles. Meanwhile, thermal resistance of die attach with different bonding materials was also evaluated by a T3ster, which suggests the Ag sinter-joining owns a superior property of thermal conduction than the traditional solder joining. This investigation indicates that the Ag sinter-joining has a long lifetime under a severe operating condition of power electronics.
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Acknowledgements
This paper is based on results obtained from a project (JPNP14004) commissioned by the New Energy and Industrial Technology Development Organization (NEDO). The author acknowledges the Comprehensive Analysis Center of Osaka University for the use of and TG-DTA, Daicel Company in Japan for providing the solvent, and the Network Joint Research Centre for Materials and Devices, Dynamic Alliance for Open Innovation Bridging Human, Environment and Materials.
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Zhang, Z., Chen, C., Suetake, A., Hsieh, MC., Iwaki, A., Suganuma, K. (2021). Reliability Evaluation of Ag Sinter-Joining Die Attach Under a Harsh Thermal Cycling Test. In: TMS 2021 150th Annual Meeting & Exhibition Supplemental Proceedings. The Minerals, Metals & Materials Series. Springer, Cham. https://doi.org/10.1007/978-3-030-65261-6_63
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DOI: https://doi.org/10.1007/978-3-030-65261-6_63
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