1. Preface

   Pages: 137 - 137

2. Sensors and smart electronics in harsh environment applications

   • W. R. Fahrner
   • R. Job
   • M. Werner

   Pages: 138 - 144

3. Highly parallel mass fabrication and assembly of microdevices

   • W. Ehrfeld
   • M. Begemann
   • M. Nienhaus

   Pages: 145 - 150

4. Dicing challenges in microelectronics and micro electro-mechanical systems (MEMS)

   • H. H. Gatzen

   Pages: 151 - 154

5. Plastic reshaping of silicon microstructures: process, characterization and application

   • E. Gärtner
   • J. Frühauf
   • E. Jänsch

   Pages: 155 - 160

6. Internal stresses and lifetime evaluation of PECVD isolating layers

   • A. Dommann
   • N. Herres
   • B. Stämpfli

   Pages: 161 - 164

7. Shape memory microactuators

   • S. Büttgenbach
   • S. Bütefisch
   • A. Wogersien

   Pages: 165 - 170

8. Micromechanical three-axial tactile force sensor for micromaterial characterisation

   • S. Bütefisch
   • S. Büttgenbach
   • U. Brand

   Pages: 171 - 174

9. Fatigue of directly wafer-bonded silicon under static and cyclic loading

   • J. Bagdahn
   • M. Petzold

   Pages: 175 - 182

10. Micro materials modeling in MINIMOS-NT

    • V. Palankovski
    • S. Selberherr

    Pages: 183 - 187

11. Integration of micro-mechatronics in automotive applications

    • F. Ansorge
    • K.-F. Becker
    • H. Reichl

    Pages: 188 - 190

12. Micro-metalforming with silicon dies

    • J. Böhm
    • A. Schubert
    • T. Burkhardt

    Pages: 191 - 195

13. Application of electroplating in MEMS-micromachining exemplified by a microrelay

    • M. Becker
    • D. Lütke Notarp
    • B. Michel

    Pages: 196 - 202