Integration of micro-mechatronics in automotive applications

Abstract

 Micro-Mechatronics and System Integration is a multidisciplinary field, which offers low cost system solutions based on the principle of homogenizing system components and consequent elimination of at least one material component or packaging level from the system. These system approaches show, compared to the existing solutions, a higher functionality, more intelligence and better reliability performance. The number of interconnects necessary to link a motor, or sensor, or an actuator to the digital bus decreases, as the smartness of the devices increases. The paper presents system solutions and manufacturing technology for mechatronic systems, developed at Fraunhofer IZM. To reduce package volume, advanced packaging technologies as Flip Chip and CSP are used, for increased reliability and additional mechanical functionality encapsulation processes as transfer-molding, a combination of transfer- and injection-molding or modular packaging toolkit based on LTCC are selected. The first system is a multi-chip-module for motor control used for automotive applications as window-lifts or sun-roofs. For the module at least three interconnection layers were eliminated using novel concepts as intelligent leadframes and integrated plugs. The package resists harsh environment as present in automotive applications. Another mechatronic package called TB-BGA or StackPac respectively, is a 3-D solution, containing a pressure sensor and the complete electronics necessary for control and data transfers. This package involves CSP-technologies on flex, with an increase of functionality per volume unit by direct CSP-to-CSP mounting, eliminating substrate layers and large signal distances of unamplified signals from sensor output. The mechatronic packages will be discussed in detail. Especially cost, reliability performance and according “Design for Reliability” show the potential of micro-mechatronic solutions in automotive and industrial applications.