Layered Sb2Te3 Nanoflakes as Chalcogenide Dielectrics Punita SrivastavaKedar Singh OriginalPaper 18 June 2013 Pages: 2733 - 2738
Synthesis of Graphene Sheets and Characterization of Poly(3-hexylthiophene):Graphene Blends F. Abd WahabK. SulaimanN. M. Huang OriginalPaper 25 June 2013 Pages: 2739 - 2742
Thermal-Optical Properties of Polymethylmethacrylate/Silver Nitrate Films M. AbdelazizE. M. Abdelrazek OriginalPaper 25 June 2013 Pages: 2743 - 2751
Thermoelectric Power Generation Characteristics of a Thin-Film Device Consisting of Electrodeposited n-Bi2Te3 and p-Sb2Te3 Thin-Film Legs Min-Young KimTae-Sung Oh OriginalPaper 12 July 2013 Pages: 2752 - 2757
Effect of Chromium Doping on the Thermoelectric Properties of Bi2Te3: Cr x Bi2Te3 and Cr x Bi2−x Te3 Mi-Kyung HanHyein RyuSung-Jin Kim OriginalPaper 16 July 2013 Pages: 2758 - 2763
Relaxation Dynamics and Threading Dislocations in ZnSe and ZnS y Se1−y /GaAs (001) Heterostructures T. KujofsaS. CherukuJ. E. Ayers OriginalPaper 11 July 2013 Pages: 2764 - 2770
An Approach for Enhancement of Saturation Magnetization in Cobalt Ferrite Nanoparticles by Incorporation of Terbium Cation Tahmineh SodaeeAli GhasemiAkimitsu Morisako OriginalPaper 11 July 2013 Pages: 2771 - 2783
Structural, Magnetic, and Microwave Properties of SrFe12−x (Ni0.5Co0.5Sn) x/2O19 Particles Synthesized by Sol–Gel Combustion Method Mohammad MousaviniaAli GhasemiEbrahim Paimozd OriginalPaper 27 June 2013 Pages: 2784 - 2792
Pd-Doped Tin-Oxide-Based Thick-Film Sensor Array for Detection of H2, CH4, and CO Meenakshi ChoudharyV. N. MishraR. Dwivedi OriginalPaper 12 July 2013 Pages: 2793 - 2802
Cyanate Ester-Based Encapsulation Material for High-Temperature Applications Vivek ChidambaramEric Phua Jian RongRhee Min Woo Daniel OriginalPaper 11 July 2013 Pages: 2803 - 2812
Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates Jenn-Ming SongMeng-Ju LinYing-Ta Chiu OriginalPaper 18 June 2013 Pages: 2813 - 2821
Effect of High-Humidity Testing on Material Parameters of Flexible Printed Circuit Board Materials Sanna LahokallioKirsi SaarinenLaura Frisk OriginalPaper 18 June 2013 Pages: 2822 - 2834
Effect of Trace Diamond Nanoparticle Addition on the Interfacial, Mechanical, and Damping Properties of Sn-3.0Ag-0.5Cu Solder Alloy I. ShafiqH.Y. LauY.C. Chan OriginalPaper 18 June 2013 Pages: 2835 - 2847
Failure Analysis of Board-Level Sn-Ag-Cu Solder Interconnections Under JEDEC Standard Drop Test Bo ZhangJing Si XiHan Ding OriginalPaper 11 July 2013 Pages: 2848 - 2855