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Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates

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Abstract

In this study, the high-speed deformation behavior of solder joints formed with Pb-free Zn-Sn and commercial Pb-Sn alloys bonded on different substrates was investigated by the ball impact test method. Overall, Zn-Sn joints exhibited greater impact strength but inferior impact toughness than Pb-Sn joints. This can be ascribed to the high hardness of Zn-Sn solders resulting in partial or overall interfacial fracture. In contrast, the joints with soft Pb-Sn solders all showed a ductile fracture feature. It is suggested that, for the joints revealing brittle fracture, the impact toughness (impact energy) increased with the plastic ability of interfacial intermetallic compounds, while for those showing a ductile fracture mode, the impact energy deteriorated with a hardened solder matrix resulting from substrate dissolution.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Chung Hsing University, Taichung, 402, Taiwan, ROC

    Jenn-Ming Song, Kun-Hung Hsieh & Tsung-Yun Pai

  2. Department of Materials Science and Engineering, National Dong Hwa University, Hualien, 974, Taiwan, ROC

    Meng-Ju Lin

  3. Central Labs, Advanced Semiconductor Engineering, Inc., Kaohsiung, 811, Taiwan, ROC

    Yi-Shao Lai & Ying-Ta Chiu

Authors
  1. Jenn-Ming Song
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  2. Meng-Ju Lin
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  3. Kun-Hung Hsieh
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  4. Tsung-Yun Pai
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  5. Yi-Shao Lai
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  6. Ying-Ta Chiu
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Correspondence to Jenn-Ming Song.

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Song, JM., Lin, MJ., Hsieh, KH. et al. Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates. J. Electron. Mater. 42, 2813–2821 (2013). https://doi.org/10.1007/s11664-013-2653-5

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  • DOI: https://doi.org/10.1007/s11664-013-2653-5

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