Volume 41, Issue 12

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December 2012

Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XI

27 articles in this issue

Thermal and Mechanical Stability of Ce-Containing Sn-3.9Ag-0.7Cu Lead-Free Solder on Cu and Electroless Ni-P Metallizations
Huxiao Xie
Nikhilesh Chawla
Kabir Mirpuri
OriginalPaper 22 June 2012 Pages: 3249 - 3258
Liquid-State Interfacial Reactions of Sn-Zn/Co Couples at 250°C
Chao-hong Wang
Sheng-en Huang
Jian-lin Liu
OriginalPaper 14 August 2012 Pages: 3259 - 3265
Gold- and Palladium-Induced Embrittlement Phenomenon in Microbumps with Au/Pd(P)/Ni(P) Metallization Pads
C.E. Ho
W.H. Wu
Y.C. Lin
OriginalPaper 04 August 2012 Pages: 3266 - 3275
Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications
C.E. Ho
T.T. Kuo
F.M. Ma
OriginalPaper 01 August 2012 Pages: 3276 - 3283
Interfacial Reactions Between Sn-Zn Alloys and Au Substrate
Yee-wen Yen
Ming-chih Lin
Wan-ching Chen
OriginalPaper 07 August 2012 Pages: 3284 - 3291
Kinetics of Solid-State Reactive Diffusion in the (Ni-Cr)/Sn System
K. Motojima
T. Asano
M. Kajihara
OriginalPaper 06 September 2012 Pages: 3292 - 3302
Interfacial Reactions and Mechanical Properties of Bi-x wt.%Sn/Cu Joints (x = 2, 5, 10)
Jin-Yi Wang
Chih-Fan Lin
Chih-Ming Chen
OriginalPaper 11 September 2012 Pages: 3303 - 3308
Influence of External Strain on the Growth of Interfacial Intermetallic Compounds Between Sn and Cu Substrates
Tien-Chen Hu
Feng-chih Hsu
Ming-Tzer Lin
OriginalPaper 29 September 2012 Pages: 3309 - 3319
Evaluation of Diffusion Barrier Between Pure Sn and Te
Chang-Yen Ko
Albert T. Wu
OriginalPaper 02 October 2012 Pages: 3320 - 3324
Interfacial Reactions Between Diffusion Barriers and Thermoelectric Materials Under Current Stressing
Li-Chen Lo
Albert T. Wu
OriginalPaper 12 October 2012 Pages: 3325 - 3330
NiSn₄ Formation in As-Soldered Ni-Sn and ENIG-Sn Couples
S. A. Belyakov
C. M. Gourlay
OriginalPaper 23 October 2012 Pages: 3331 - 3341
Electromigration Study on Sn(Cu) Solder/Ni(P) Joint Interfaces
S.H. Wu
Y.J. Hu
C.Y. Liu
OriginalPaper 27 October 2012 Pages: 3342 - 3347
Effects of Pd(P) Thickness on the Microstructural Evolution Between Sn-3Ag-0.5Cu and Ni(P)/Pd(P)/Au Surface Finish During the Reflow Process
Bo-Mook Chung
Yong-Ho Baek
Joo-Youl Huh
OriginalPaper 06 November 2012 Pages: 3348 - 3358
Atomic Mobilities in the Ag-Cu-Sn Face-Centered Cubic Lattice
W. Gierlotka
Y.H. Chen
M.A. Rahman
OriginalPaper 27 October 2012 Pages: 3359 - 3367
Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates
Yu-Hsiang Hsiao
Kwang-Lung Lin
Yi-Shao Lai
OriginalPaper 27 October 2012 Pages: 3368 - 3374
Fabrication of CIGS Films by Electrodeposition Method for Photovoltaic Cells
Hyunju Lee
Hyukjoo Yoon
Yangdo Kim
OriginalPaper 29 September 2012 Pages: 3375 - 3381
Electrical and Optical Properties of p-Type Li,Cu-Codoped NiO Thin Films
Xinman Chen
Lingzhi Zhao
Qiaoli Niu
OriginalPaper 11 September 2012 Pages: 3382 - 3386
Effect of Inverse Doped Surface Layer in Schottky Barrier Modification: A Numerical Study
Subhash Chand
Priyanka Kaushal
Jozef Osvald
OriginalPaper 18 September 2012 Pages: 3387 - 3392
Improved Optoelectronic Properties of Rapid Thermally Annealed Dilute Nitride GaInNAs Photodetectors
S.L. Tan
C.J. Hunter
J.P.R. David
OriginalPaper 29 September 2012 Pages: 3393 - 3401
Thermoelectric Properties of Heavy Rare Earth Filled Skutterudites Dy_yFe_xCo_4−xSb₁₂
Tao Luo
Ruiheng Liu
Lidong Chen
OriginalPaper 29 September 2012 Pages: 3402 - 3410
Effects of Bi₂Se₃ Nanoparticle Inclusions on the Microstructure and Thermoelectric Properties of Bi₂Te₃-Based Nanocomposites
HeeJin Kim
Mi-Kyung Han
Sung-Jin Kim
OriginalPaper 29 September 2012 Pages: 3411 - 3416
Electrode Materials for Ge₂Sb₂Te₅-Based Memristors
Q. Wang
H.J. Sun
X.S. Miao
OriginalPaper 28 September 2012 Pages: 3417 - 3422
Highly Textured Mn₁₅Si₂₆ Film Obtained by High-Temperature Treatment
R. Zirmi
A. Portavoce
M.-C. Record
OriginalPaper 29 September 2012 Pages: 3423 - 3426
Effect of a Nanodimensional Polyethylenimine Layer on Current–Voltage Characteristics of Hybrid Structures Based on Single-Crystal Silicon
I.V. Malyar
D.A. Gorin
S. Santer
OriginalPaper 29 September 2012 Pages: 3427 - 3435
Microstructural Investigation of Interfacial Features in Al Wire Bonds
G. Khatibi
B. Weiss
S. Schwarz
OriginalPaper 14 September 2012 Pages: 3436 - 3446
Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation
X. N. Li
L.J. Liu
C. Dong
BriefCommunication 29 September 2012 Pages: 3447 - 3452
Rediscovery of the Role of the i-Layer in n-ZnO/SiO₂/p-GaN Through Observations from Both the ZnO and GaN Sides
Yuanda Liu
Hongwei Liang
Guotong Du
BriefCommunication 29 September 2012 Pages: 3453 - 3456

Volume 41, Issue 12

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