Deep Traps in AlGaN/GaN Heterostructure Field-Effect Transistors Studied by Current-Mode Deep-Level Transient Spectroscopy: Influence of Device Location Z.-Q. FangB. ClaflinD.C. Look OriginalPaper 15 October 2011 Pages: 2337 - 2343
Elevated-Temperature Annealing Effects on AlGaN/GaN Heterostructures Benedict OfuonyeJaesun LeeIlesanmi Adesida OriginalPaper 15 October 2011 Pages: 2344 - 2347
S-Graded Buffer Layers for Lattice-Mismatched Heteroepitaxial Devices S. XhurxhiF. ObstJ. E. Ayers OriginalPaper 13 October 2011 Pages: 2348 - 2354
Study of 4H-SiC JBS Diodes Fabricated with Tungsten Schottky Barrier M. BerthouP. GodignonD. Planson OriginalPaper 06 October 2011 Pages: 2355 - 2362
Fabrication and Characterization of Silicon Microchannel Plates as Temperature-Sensing Materials Pengliang CiJing ShiPaul K. Chu OriginalPaper 13 October 2011 Pages: 2363 - 2367
Increase in the Thermoelectric Efficiency of the Disordered Phase of Layered Antiferromagnetic CuCrS2 Girish C. TewariT.S. TripathiGovind Gupta OriginalPaper 15 October 2011 Pages: 2368 - 2373
High-Vacuum Evaporation of n-CuIn3Se5 Photoabsorber Films for Hybrid PV Structures N. AdhikariS. BereznevE. Mellikov OriginalPaper 23 September 2011 Pages: 2374 - 2381
Structural, Optical, and Electrical Properties of Nb-Doped ZnO Thin Films Prepared by Spray Pyrolysis Method V. GokulakrishnanS. ParthibanK. Ramamurthi OriginalPaper 13 October 2011 Pages: 2382 - 2387
Luminescence of 2,6-Distyrylpyridine-Doped Titania Nanostructured Monoliths R. Palomino-MerinoM. Judith PercinoV.M. Castaño OriginalPaper 18 October 2011 Pages: 2388 - 2391
Self-Assembly, Optical, and Electrical Properties of a Novel Water-Soluble Perylene Bisimide Gopal BoobalanPredhanekar Mohamed ImranSamuthira Nagarajan BriefCommunication 15 October 2011 Pages: 2392 - 2397
A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles Y. MorisadaT. NagaokaY. Yoshida OriginalPaper 13 October 2011 Pages: 2398 - 2402
Uniaxial Ratchetting Behavior of Solder Alloys and Its Simulation by an Elasto-Plastic-Creep Constitutive Model Katsuhiko SasakiKen-ichi Ohguchi OriginalPaper 06 October 2011 Pages: 2403 - 2414
Microvoid Formation at Solder–Copper Interfaces During Annealing: a Systematic Study of the Root Cause Santosh KumarJoseph SmetanaCarol A. Handwerker OriginalPaper 28 September 2011 Pages: 2415 - 2424
Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects X. P. LiJ. M. XiaX. P. Zhang OriginalPaper 14 October 2011 Pages: 2425 - 2435
Effects of Minor Amounts of Zn on the Sn-Zn/Ni Interfacial Reactions and Phase Equilibria of the Ternary Sn-Zn-Ni System at 250°C Chao-hong WangHsien-hsin ChenWei-han Lai OriginalPaper 14 October 2011 Pages: 2436 - 2444
Grain Orientation Evolution and Deformation Behaviors in Pb-Free Solder Interconnects Under Mechanical Stresses H.T. ChenL. WangJ.M. Kim OriginalPaper 13 October 2011 Pages: 2445 - 2457
One-Step Fabrication of Al/Sn-Bi Core–Shell Spheres via Phase Separation R. DaiS.G. ZhangJ.G. Li OriginalPaper 18 October 2011 Pages: 2458 - 2464
Surface Tension, Density, and Thermal Expansion of (Bi-Ag)eut-Zn Alloys Janusz PstruśPrzemyslaw FimaWladyslaw Gąsior OriginalPaper Open access 14 October 2011 Pages: 2465 - 2469
Localized Recrystallization Induced by Subgrain Rotation in Sn-3.0Ag-0.5Cu Ball Grid Array Solder Interconnects During Thermal Cycling Hongtao ChenJing HanMingyu Li OriginalPaper 13 October 2011 Pages: 2470 - 2479
Metal-Assisted Chemical Etching Using Tollen’s Reagent to Deposit Silver Nanoparticle Catalysts for Fabrication of Quasi-ordered Silicon Micro/Nanostructures Xuewen GengMeicheng LiPaul W. Bohn OriginalPaper 29 September 2011 Pages: 2480 - 2485
