Influence of Surface Modification with Carboxylic Acids on Performance of Polymer/Titania Photovoltaic Devices Hongwei GengQiyun QuMingtai Wang OriginalPaper 26 September 2009 Pages: 1 - 7
Synthesis and Characterization of p-Type Pb0.5Sn0.5Te Thermoelectric Power Generation Elements by Mechanical Alloying Aaron D. LaLondePeter D. Moran OriginalPaper 10 November 2009 Pages: 8 - 14
Effects of Growth Temperature and Postgrowth Annealing on Inhomogeneous Luminescence Characteristics of Green-Emitting InGaN Films Hisashi MasuiThiago MeloSteven P. DenBaars OriginalPaper Open access 03 November 2009 Pages: 15 - 20
Temperature-Dependent Studies of Si-Implanted Al0.33Ga0.67N with Different Annealing Temperatures and Times E.A. MooreY.K. YeoR.L. Hengehold OriginalPaper 26 September 2009 Pages: 21 - 28
High-Sensitivity Nitride-Based Ultraviolet Photosensors with a Low-Temperature AlGaN Interlayer K. H. LeeP. C. ChangC. H. Liu OriginalPaper 30 September 2009 Pages: 29 - 33
Heavily Aluminum-Doped Epitaxial Layers for Ohmic Contact Formation to p-Type 4H-SiC Produced by Low-Temperature Homoepitaxial Growth B. KrishnanS.P. KotamrajuY. Koshka OriginalPaper 01 October 2009 Pages: 34 - 38
Anomalous Effect of Hydrogen Dilution on the Crystallinity of ICPCVD-Grown Silicon Thin Films at Very Low Temperature A.J. LethaF.M. ChanH.L. Hwang OriginalPaper 05 November 2009 Pages: 39 - 42
Ex Situ Thermal Cycle Annealing of Molecular Beam Epitaxy Grown HgCdTe/Si Layers S. FarrellG. BrillK. Harris OriginalPaper 29 September 2009 Pages: 43 - 48
Application of an Artificial Intelligence Technique to Improve Purification in the Zone Refining Process Thais CheungNoé CheungAmauri Garcia OriginalPaper 24 September 2009 Pages: 49 - 55
Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys C. M. GourlayK. NogitaA. K. Dahle OriginalPaper Open access 13 November 2009 Pages: 56 - 69
Physical Properties of Sn96.5Ag3.5-Based Solders with Additions of Bi, Ge, and In I. KabanK. KhaloukJ.-G. Gasser OriginalPaper 24 September 2009 Pages: 70 - 76
Multiscale Simulation of Microstructural Changes in Solder Interconnections During Thermal Cycling J. LiT. T. MattilaJ. K. Kivilahti OriginalPaper 29 September 2009 Pages: 77 - 84
Conductive Anodic Filament (CAF) Formation Part I: the Influence of Water-Soluble Flux on Its Formation Antonio CaputoLaura J. TurbiniDoug D. Perovic OriginalPaper 11 November 2009 Pages: 85 - 91
Conductive Anodic Filament Formation Part II: Electrochemical Reactions Leading to CAF Antonio CaputoLaura J. TurbiniDoug D. Perovic OriginalPaper 11 November 2009 Pages: 92 - 96
Compression Stress–Strain Behavior of Sn-Ag-Cu Solders Edwin P. LopezPaul T. ViancoAlice Kilgo OriginalPaper 12 November 2009 Pages: 97 - 104
Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements Monika Leodolter-DworakIlse SteffanHerbert Ipser OriginalPaper 06 October 2009 Pages: 105 - 108
Size and Substrate Effects upon Undercooling of Pb-Free Solders Yu-chih HuangSinn-wen ChenKuang-siang Wu OriginalPaper 10 November 2009 Pages: 109 - 114
Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives Li-Ngee HoHiroshi NishikawaKoyu Ota OriginalPaper 24 September 2009 Pages: 115 - 123
Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization Hui XuChangqing LiuZhong Chen OriginalPaper 24 September 2009 Pages: 124 - 131
Growth of Epitaxial (110) 0.7Pb(Mg1/3Nb2/3)O3-0.3PbTiO3 Thin Films on r-Plane Sapphire Substrates by RF Magnetron Sputtering Lakshmi KrishnaMadhana SunderP.D. Moran OriginalPaper 25 September 2009 Pages: 132 - 137
Interfacial Effects in the Relaxation Dynamics of Silver Nanometal-Glass Composites Probed by Transient Grating Spectroscopy J. A. JiménezS. LysenkoH. Liu OriginalPaper 29 September 2009 Pages: 138 - 143
