1. Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model

   • P. T. Vianco
   • J. A. Rejent

   OriginalPaper Open access 07 July 2009 Pages: 1815 - 1825

2. Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study

   • P. T. Vianco
   • J. A. Rejent

   OriginalPaper 07 July 2009 Pages: 1826 - 1837

3. Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 1: Eutectic Lead Solder

   • H. Zhao
   • H. Q. Wang
   • Y. Y. Qian

   OriginalPaper 30 June 2009 Pages: 1838 - 1845

4. Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 2: Lead-Free Solders

   • H. Zhao
   • H. Q. Wang
   • Y. Y. Qian

   OriginalPaper 30 June 2009 Pages: 1846 - 1854

5. Constitutive Relations of Indium in Extreme-Temperature Electronic Packaging Based on Anand Model

   • Rui Wu Chang
   • F. Patrick McCluskey

   OriginalPaper 13 June 2009 Pages: 1855 - 1859

6. Intermetallic Reaction of Indium and Silver in an Electroplating Process

   • Pin J. Wang
   • Jong S. Kim
   • Chin C. Lee

   OriginalPaper Open access 09 June 2009 Pages: 1860 - 1865

7. Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles

   • Yaowu Shi
   • Yanfu Yan
   • Xiaoyan Li

   OriginalPaper 22 May 2009 Pages: 1866 - 1873

8. Monitoring the Growth of the α Phase in Tin Alloys by Electrical Resistance Measurements

   • D. Di Maio
   • C. P. Hunt

   OriginalPaper 28 April 2009 Pages: 1874 - 1880

9. A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

   • Konstantina Lambrinou
   • Wout Maurissen
   • Ingrid De Wolf

   OriginalPaper 28 May 2009 Pages: 1881 - 1895

10. Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size

    • Woong Ho Bang
    • Choong-Un Kim
    • Kyu Hwan Oh

    OriginalPaper 28 May 2009 Pages: 1896 - 1905

11. Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints

    • Wenxing Dong
    • Yaowu Shi
    • Fu Guo

    OriginalPaper 22 May 2009 Pages: 1906 - 1912

12. Rutherford Backscattering Spectrometry Analysis of Self-Formed Ti-Rich Interface Layer Growth in Cu(Ti)/Low-k Samples

    • Kazuyuki Kohama
    • Kazuhiro Ito
    • Masanori Murakami

    OriginalPaper 28 May 2009 Pages: 1913 - 1920

13. Low Fatigue in Epitaxial Pb(Zr_0.2Ti_0.8)O₃ on Si Substrates with LaNiO₃ Electrodes by RF Sputtering

    • Chun Wang
    • Mark H. Kryder

    OriginalPaper 13 May 2009 Pages: 1921 - 1925

14. Amorphization and Solid-Phase Epitaxial Growth of C-Cluster Ion-Implanted Si

    • N.G. Rudawski
    • L.R. Whidden
    • K.S. Jones

    BriefCommunication Open access 25 June 2009 Pages: 1926 - 1930

15. How r-Plane Al₂O₃ Surface Modifications Impact the Growth of Epitaxial (001) CeO₂ Thin Films

    • Madhana Sunder
    • P. D. Moran

    OriginalPaper 25 June 2009 Pages: 1931 - 1937

16. Comparative Study on MOCVD Growth of a-Plane GaN Films on r-Plane Sapphire Substrates Using GaN, AlGaN, and AlN Buffer Layers

    • J. N. Dai
    • Z. H. Wu
    • C. Q. Chen

    OriginalPaper 11 June 2009 Pages: 1938 - 1943

17. Electrical Characterization of Different Passivation Treatments for Long-Wave Infrared InAs/GaSb Strained Layer Superlattice Photodiodes

    • Koushik Banerjee
    • Siddhartha Ghosh
    • Sanjay Krishna

    OriginalPaper 16 June 2009 Pages: 1944 - 1947

18. Interband Cascade Lasers with Wavelengths Spanning 3.2–4.2 μm

    • C. L. Canedy
    • J. R. Lindle
    • J. R. Meyer

    OriginalPaper 10 March 2009 Pages: 1948 - 1951

19. Edge-Emitting Lead Salt Mid-Infrared Laser Structure on BaF₂ (110) Substrate

    • D. Li
    • S. Mukherjee
    • Z. Shi

    OriginalPaper 21 April 2009 Pages: 1952 - 1955

20. p-Type PbTe Thermoelectric Bulk Materials with Nanograins Fabricated by Attrition Milling and Spark Plasma Sintering

    • Chia-Hung Kuo
    • Ming-Shan Jeng
    • Chii-Shyang Hwang

    OriginalPaper 05 February 2009 Pages: 1956 - 1961

21. Characterization of Zn_1−x Mg _x O Films Prepared by the Sol–Gel Process and Their Application for Thin-Film Transistors

    • Chien-Yie Tsay
    • Min-Chi Wang
    • Shin-Chuan Chiang

    OriginalPaper Open access 22 May 2009 Pages: 1962 - 1968

22. Preparation and Characterization of Ultrasonically Sprayed Zinc Oxide Thin Films Doped with Lithium

    • Vildan Bilgin

    OriginalPaper 22 May 2009 Pages: 1969 - 1978

23. Silicon Nitride Films Deposited by RF Sputtering for Microstructure Fabrication in MEMS

    • Vivekanand Bhatt
    • Sudhir Chandra

    OriginalPaper 03 June 2009 Pages: 1979 - 1989

24. Two Layer Surface Exfoliation on Si₃N₄/Si by Sequential Implantation of He and H Ions

    • Mengkai Li
    • Zhuo Wang
    • Bing Yuan

    OriginalPaper 31 March 2009 Pages: 1990 - 1994

25. Electrical Properties of Organic–Inorganic Semiconductor Device Based on Rhodamine-101

    • M. Çakar
    • Ö. Güllü
    • A. Türüt

    OriginalPaper 27 May 2009 Pages: 1995 - 1999

26. Synthesis and Characterization of Naphthalene End-Capped Divinylbenzene for OTFT

    • Sung Jin Park
    • Sul Ong Kim
    • Soon-Ki Kwon

    OriginalPaper 12 May 2009 Pages: 2000 - 2005

27. Femtosecond Laser Drilling of Alumina Wafers

    • Chengde Li
    • Seongkuk Lee
    • Suwas Nikumb

    OriginalPaper 30 April 2009 Pages: 2006 - 2012

28. Electrical Properties of Isotropic Conductive Adhesives Composed of Silicone-Based Elastomer Binders Containing Ag Particles

    • Masahiro Inoue
    • Hiroaki Muta
    • Katsuaki Suganuma

    OriginalPaper 27 May 2009 Pages: 2013 - 2022