Volume 38, Issue 5

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May 2009

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13 articles in this issue

The Potential of the Perturbed Angular Correlation Technique in Characterizing Semiconductors
Rakesh Dogra
A.P. Byrne
M.C. Ridgway
OriginalPaper Open access 24 January 2009 Pages: 623 - 634
Low-Dimensional Waveguide Grating Fabrication in GaN with Use of SiCl₄/Cl₂/Ar-Based Inductively Coupled Plasma Dry Etching
R. Dylewicz
S. Patela
A. Tahraoui
OriginalPaper 04 March 2009 Pages: 635 - 639
Evolution of Luminescence from Doped Gallium Phosphide over 40 Years
Sergei Pyshkin
John Ballato
Giorgio Turri
OriginalPaper 05 February 2009 Pages: 640 - 646
In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal
I. Lum
C. J. Hang
Y. Zhou
OriginalPaper 03 March 2009 Pages: 647 - 654
Peltier Effect on Sn/Co Interfacial Reactions
Chao-hong Wang
Sinn-wen Chen
OriginalPaper 27 February 2009 Pages: 655 - 662
Lead-Free Bumping Using an Alternating Electromagnetic Field
Hongbo Xu
Mingyu Li
Ling Wang
OriginalPaper 19 February 2009 Pages: 663 - 669
Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys
N. Hidaka
H. Watanabe
M. Yoshiba
OriginalPaper 07 February 2009 Pages: 670 - 677
Thermomechanical Stress and Strain in Solder Joints During Electromigration
J.S. Zhang
H.J. Xi
F.S. Wu
OriginalPaper 05 February 2009 Pages: 678 - 684
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package
Y. K. Jee
J. Yu
T. S. Oh
OriginalPaper 13 January 2009 Pages: 685 - 690
Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na₂SO₄ Solutions
Ja-Young Jung
Shin-Bok Lee
Young-Bae Park
OriginalPaper 13 January 2009 Pages: 691 - 699
Interdiffusion and Growth of the Superconductor Nb₃Sn in Nb/Cu(Sn) Diffusion Couples
A.K. Kumar
A. Paul
OriginalPaper 09 January 2009 Pages: 700 - 705
High-Temperature Capacitor Materials Based on Modified BaTiO₃
Y. Yuan
S.R. Zhang
B. Li
OriginalPaper 28 February 2009 Pages: 706 - 710
Microwave Dielectric Properties of ZnO-2TiO₂-Nb₂O₅ Ceramics with BaCu (B₂O₅) Addition
Huanfu Zhou
Hong Wang
Xi Yao
OriginalPaper 21 February 2009 Pages: 711 - 716

Volume 38, Issue 5

The Potential of the Perturbed Angular Correlation Technique in Characterizing Semiconductors

Low-Dimensional Waveguide Grating Fabrication in GaN with Use of SiCl₄/Cl₂/Ar-Based Inductively Coupled Plasma Dry Etching

Evolution of Luminescence from Doped Gallium Phosphide over 40 Years

In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal

Peltier Effect on Sn/Co Interfacial Reactions

Lead-Free Bumping Using an Alternating Electromagnetic Field

Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys

Thermomechanical Stress and Strain in Solder Joints During Electromigration

Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package

Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na₂SO₄ Solutions

Interdiffusion and Growth of the Superconductor Nb₃Sn in Nb/Cu(Sn) Diffusion Couples

High-Temperature Capacitor Materials Based on Modified BaTiO₃

Microwave Dielectric Properties of ZnO-2TiO₂-Nb₂O₅ Ceramics with BaCu (B₂O₅) Addition

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