Some Practical Issues of Curvature and Thermal Stress in Realistic Multilevel Metal Interconnect Structures T.-S. ParkM. DaoS. Shankar OriginalPaper 18 March 2008 Pages: 777 - 791
Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations V. VuorinenH. YuJ.K. Kivilahti OriginalPaper Open access 14 March 2008 Pages: 792 - 805
Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound Seishi KumamotoHitoshi SakuraiKatsuaki Suganuma OriginalPaper 14 March 2008 Pages: 806 - 814
Diffusion-Reaction in the Au-Rich Ternary Au-Pt-Sn System as a Basis for Ternary Diffusion Soldering Vincent GrolierRainer Schmid-Fetzer OriginalPaper 07 March 2008 Pages: 815 - 828
Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling E.H. WongC.S. SelvanayagamC.-L. Yeh OriginalPaper 06 March 2008 Pages: 829 - 836
Fabrication and Microstructures of Sequentially Electroplated Sn-Rich Au-Sn Alloy Solders Wenming TangAnqiang HeDouglas G. Ivey OriginalPaper 27 February 2008 Pages: 837 - 844
Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging T.I. ShihJ.G. Duh OriginalPaper 20 February 2008 Pages: 845 - 851
Enhancement of Oxidation Resistance and Electrical Properties of Indium-Doped Copper Thin Films C.S. HsuH.Y. HsiehJ.S. Fang OriginalPaper 21 February 2008 Pages: 852 - 859
Enhancing the Mechanical Response of a Lead-Free Solder Using an Energy-Efficient Microwave Sintering Route P. BabaghorbaniM. Gupta OriginalPaper 21 February 2008 Pages: 860 - 866
The Shear Strength and Fracture Behavior of Sn-Ag-xSb Solder Joints with Au/Ni-P/Cu UBM Hwa-Teng LeeShuen-Yuan HuYin-Fa Chen OriginalPaper 22 February 2008 Pages: 867 - 873
Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy Ping LiuPei YaoJim Liu OriginalPaper 23 February 2008 Pages: 874 - 879
Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability Luhua XuJohn H. L. PangFaxing Che OriginalPaper 23 February 2008 Pages: 880 - 886
Electromigration of Sn-9wt.%Zn Solder Yu-Min HungChih-Ming Chen OriginalPaper 26 February 2008 Pages: 887 - 893
Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints Min-Na ChenShi-Jin DingLi-Kang Wang OriginalPaper 11 March 2008 Pages: 894 - 900
Novel Cu/Cr/Ge/Pd Ohmic Contacts on Highly Doped n-GaAs Kartika Chandra SahooChun-Wei ChangChing-Ting Lee OriginalPaper 27 February 2008 Pages: 901 - 904
a-Si:C:H and a-Si:N:H Thin Films Obtained by PECVD for Applications in Silicon Solar Cells T. StapinskiB. Swatowska OriginalPaper 25 March 2008 Pages: 905 - 911
Magneto-transport Properties of a GaMnAs-Based Ferromagnetic Semiconductor Trilayer Structure Grown on a ZnMnSe Buffer S.J. ChungD.Y. ShinJ.K. Furdyna OriginalPaper 27 February 2008 Pages: 912 - 916
Structural and Chemical Comparison of Graphite and BN/AlN Caps Used for Annealing Ion Implanted SiC K.A. JonesM.C. WoodS. Dhar OriginalPaper 11 March 2008 Pages: 917 - 924
Preparation and Characterization of Polyimide/Zirconia Composite Films Sea-Fue WangYuh-Ruey WangYu-Ping Hsaio OriginalPaper 11 March 2008 Pages: 925 - 929
Electrical Conductivity, Thermoelectric Power, and Optical Properties of Organo-Soluble Polyaniline Organic Semiconductor Fahrettin YakuphanogluBahİre Fİlİz ŞenkalAyfer Saraç OriginalPaper 26 February 2008 Pages: 930 - 934
Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis Yi-Shao LaiChin-Li Kao Erratum 26 February 2008 Pages: 935 - 935
