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The online version of the original article can be found under doi:http://dx.doi.org/10.1007/BF02692556.
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Lai, YS., Kao, CL. Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis. J. Electron. Mater. 37, 935 (2008). https://doi.org/10.1007/s11664-007-0374-3
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DOI: https://doi.org/10.1007/s11664-007-0374-3