Strength of Soldered Joints Formed under Microgravity Conditions B. ThomasA. AtkinsonR. J. Dashwood OriginalPaper 04 January 2007 Pages: 1 - 5
Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials and Solder Mask Dimensions Y. S. ChenC. S. WangT. D. Yuan OriginalPaper 28 December 2006 Pages: 6 - 16
Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints Z. ChenM. HeG.J. Qi OriginalPaper 29 December 2006 Pages: 17 - 25
Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging H.T. ChenC.Q. WangY. Huang OriginalPaper 28 December 2006 Pages: 26 - 32
Effects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints H.T. ChenC.Q. WangY.H. Tian OriginalPaper 28 December 2006 Pages: 33 - 39
Thermodynamic Properties of Liquid Ag-Bi-Sn Alloys Zuoan LiSabine KnottAdolf Mikula OriginalPaper 28 December 2006 Pages: 40 - 44
Characteristics of the Interfacial Microstructure of Chip-on-Plastic Joints under Thermal Cycling and Aging Treatment Zhi Gang ChenYoung-Ho Kim OriginalPaper 28 December 2006 Pages: 45 - 55
Study of the Formation of Bubbles in Rigid Substrate-Flexible Substrate Bonding Using Anisotropic Conductive Films and the Bubble Effects on Anisotropic Conductive Film Joint Reliability Hyoung-Joon KimChang-Kyu ChungKyung-Wook Paik OriginalPaper 04 January 2007 Pages: 56 - 64
Hygrothermal Stability of Electrical Contacts Made from Silver and Graphite Electrically Conductive Pastes Shoukai WangDick S. PangD.D.L. Chung OriginalPaper 28 December 2006 Pages: 65 - 74
Growth of Nanocrystalline ZnSe:N Films by Pulsed Laser Deposition Tingwei ZhangNing XuZhifeng Ying OriginalPaper 29 December 2006 Pages: 75 - 80
Deposition Characteristics of AlN Thin Film Prepared by the Dual Ion Beam Sputtering System T. L. HuS. W. MaoD. Gan OriginalPaper 28 December 2006 Pages: 81 - 87
Phase-Change Memory Device Using Si-Sb-Te Film for Low Power Operation and Multibit Storage Baowei QiaoJie FengBomy Chen OriginalPaper 29 December 2006 Pages: 88 - 91
Investigation of the Surface Removal Process of Silicon Carbide in Elastic Emission Machining Akihisa KubotaYohsuke ShinbayashiKazuto Yamauchi ContinuingEducation 27 December 2006 Pages: 92 - 97