1. p-n junctions in silicon nanowires

   • G. Goncher
   • R. Solanki
   • Y. Ono

   OriginalPaper Pages: 1509 - 1512

2. Seeded growth of AlN crystals on nonpolar seeds via physical vapor transport

   • D. Zhuang
   • Z. G. Herro
   • Z. Sitar

   OriginalPaper Pages: 1513 - 1517

3. Lead-free solder reinforced with multiwalled carbon nanotubes

   • S. M. L. Nai
   • J. Wei
   • M. Gupta

   OriginalPaper Pages: 1518 - 1522

4. Influence of bias-temperature stressing on the electrical characteristics of SiOC:H film with Cu/TaN/Ta-gated capacitor

   • Kou-Chiang Tsai
   • Wen-Fa Wu
   • Chuen-Guang Chao

   OriginalPaper Pages: 1523 - 1529

5. Effect of flux on the wetting characteristics of SnAg, SnCu, SnAgBi, and SnAgCu lead-free solders on copper substrates

   • Mario F. Arenas
   • Min He
   • Viola L. Acoff

   OriginalPaper Pages: 1530 - 1536

6. Three-dimensional analysis of the interface between an Sn-8wt.%Zn-3wt.%Bi solder and a substrate by using an angle-lapping method

   • Nobuhiro Ishikawa
   • Takashi Kimura
   • Takashi Sugizaki

   OriginalPaper Pages: 1537 - 1542

7. Structural defects in Si-doped III–V nitrides

   • Dmitri N. Zakharov
   • Zuzanna Liliental-Weber
   • Evelyn Hu

   OriginalPaper Pages: 1543 - 1546

8. Annealing effect on the dc transport mechanism in dysprosium oxide films grown on Si substrates

   • A. A. Dakhel

   OriginalPaper Pages: 1547 - 1551

9. Influence of substrate temperature on the properties of fluorinated silicon-nitride thin films deposited by IC-RPECVD

   • J. Fandiño
   • A. López-Suárez
   • A. Oliver

   OriginalPaper Pages: 1552 - 1557

10. Interfacial adhesion of spin-coated thin adhesive film on silicon substrate for the fabrication of polymer optical waveguide

    • M. A. Uddin
    • W. F. Ho
    • H. P. Chan

    OriginalPaper Pages: 1558 - 1565

11. Intermetallic compounds formed during diffusion soldering of Au/Cu/Al₂O₃ and Cu/Ti/Si with Sn/In interlayer

    • Tung-Han Chuang
    • Hsiu-Jen Lin
    • Cheng-Wen Tsao

    OriginalPaper Pages: 1566 - 1570

12. Durable electrochromic coatings prepared from electronically conductive poly(3HT-co-3TPP)-silica hybrid materials

    • Yuan-Hsiang Yu
    • Cheng-Yuan Lai
    • Jui-Ming Yeh

    OriginalPaper Pages: 1571 - 1580

13. Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

    • N. Dariavach
    • P. Callahan
    • R. Fournelle

    OriginalPaper Pages: 1581 - 1592

14. Investigation of electroless cobalt-phosphorous layer and its diffusion barrier properties of Pb-Sn solder

    • Muh-Wang Liang
    • Hui-Ting Yen
    • Tsung-Eong Hsieh

    OriginalPaper Pages: 1593 - 1599

15. Microstructure, creep properties, and failure mechanism of SnAgCu solder joints

    • Janne J. Sundelin
    • Sami T. Nurmi
    • Eero O. Ristolainen

    OriginalPaper Pages: 1600 - 1606

16. High-pressure preparation and thermoelectric properties of Bi_0.85Sb_0.15

    • H. J. Liu
    • L. F. Li
    • Dongliu Shi

    OriginalPaper Pages: L7 - L10