1. Low-temperature nickel-doped indium tin oxide anode for flexible organic light-emitting devices

   • Ching-Ming Hsu
   • Ching-Fong Liu
   • Wen-Tuan Wu

   OriginalPaper Pages: 383 - 387

2. Microstructure and shear strength evolution of Sn-Ag-Cu solder bumps during aging at different temperatures

   • Dezhi Li
   • Changqing Liu
   • Paul P. Conway

   OriginalPaper Pages: 388 - 398

3. The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-Al solder with Ni/Au surface finish bond pad

   • Shih-Chang Chang
   • Sheng-Chih Lin
   • Ker-Chang Hsieh

   OriginalPaper Pages: 399 - 405

4. Ohmic contact using the Si nano-interlayer for undoped-AlGaN/GaN heterostructures

   • Ho-Young Cha
   • X. Chen
   • L. F. Eastman

   OriginalPaper Pages: 406 - 410

5. Influence of pad shape on self-alignment in electronic packaging

   • Do H. Ahn
   • Jihye Lee
   • Yong-Seog Kim

   OriginalPaper Pages: 411 - 415

6. Polyol-based phase-change thermal interface materials

   • Yasuhiro Aoyagi
   • Chia-Ken Leong
   • D. D. L. Chung

   OriginalPaper Pages: 416 - 424

7. Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging

   • Qian Wang
   • Sung-Hoon Choa
   • Changyoul Moon

   OriginalPaper Pages: 425 - 432

8. Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate

   • I. Lum
   • M. Mayer
   • Y. Zhou

   OriginalPaper Pages: 433 - 442

9. Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications

   • W. K. Chiang
   • Y. C. Chan
   • Andrew Holland

   OriginalPaper Pages: 443 - 452

10. Investigation of mid-infrared type-II “W” diode lasers

    • C. L. Canedy
    • W. W. Bewley
    • J. R. Meyer

    OriginalPaper Pages: 453 - 461

11. A carbon nanotube polymer-based composite with high electromagnetic shielding

    • Wern-Shiarng Jou
    • Huy-Zu Cheng
    • Chih-Feng Hsu

    OriginalPaper Pages: 462 - 470

12. Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads

    • Chih-Chien Chi
    • Tung-Han Chuang

    OriginalPaper Pages: 471 - 478

13. Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

    • Sung K. Kang
    • Donovan Leonard
    • Jin Yu

    OriginalPaper Pages: 479 - 485

14. Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu₆Sn₅ addition

    • Szu-Tsung Kao
    • Yung-Chi Lin
    • Jenq-Gong Duh

    OriginalPaper Pages: 486 - 493

15. Influence of Ni concentration and Ni₃Sn₄ nanoparticles on morphology of Sn-Ag-Ni solders by mechanical alloying

    • Hsiang-Yi Lee
    • Jenq-Gong Duh

    OriginalPaper Pages: 494 - 503

16. Synthesis of novel micro- and mesoporous zeolite nanostructures using electrospinning techniques

    • Duraiswamy Srinivasan
    • Rashmi Rao
    • Anis Zribi

    OriginalPaper Pages: 504 - 509