1. Foreword

   • Nik Chawla
   • Srinivas Chada
   • Laura Turbini

   Special Issue Paper Pages: 2073 - 2073

2. The effect of Ag content on the formation of Ag₃Sn plates in Sn-Ag-Cu lead-free solder

   • Huann-Wu Chiang
   • Kenndy Chang
   • Jun-Yuan Chen

   Special Issue Paper Pages: 2074 - 2080

3. Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives

   • Feng Gao
   • Tadashi Takemoto
   • Hiroshi Nishikawa

   Special Issue Paper Pages: 2081 - 2087

4. Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders

   • M. A. Dudek
   • R. S. Sidhu
   • M. Renavikar

   Special Issue Paper Pages: 2088 - 2097

5. Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys

   • M. He
   • V. L. Acoff

   Special Issue Paper Pages: 2098 - 2106

6. Nanoindentation on SnAgCu lead-free solder joints and analysis

   • Luhua Xu
   • John H. L. Pang

   Special Issue Paper Pages: 2107 - 2115

7. Electromigration effect on intermetallic growth and Young’s modulus in SAC solder joint

   • Luhua Xu
   • John H. L. Pang
   • K. N. Tu

   Special Issue Paper Pages: 2116 - 2125

8. Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows

   • Zhong Chen
   • Aditya Kumar
   • M. Mona

   Special Issue Paper Pages: 2126 - 2134

9. Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates

   • Chia-Wei Huang
   • Kwang-Lung Lin

   Special Issue Paper Pages: 2135 - 2141

10. Thickness determination of ultrathin oxide films and its application in magnetic tunnel junctions

    • J. Joshua Yang
    • Chengxiang Ji
    • Allan E. Schultz

    Regular Issue Paper Pages: 2142 - 2146

11. Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration

    • Y. L. Lin
    • Y. S. Lai
    • C. R. Kao

    Regular Issue Paper Pages: 2147 - 2153

12. Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM=Co, Ni, and Zn) alloys

    • Jenn-Ming Song
    • Chi-Feng Huang
    • Hsin-Yi Chuang

    Regular Issue Paper Pages: 2154 - 2163

13. Diffusion behavior of Cu in Cu/electroless Ni and Cu/electroless Ni/Sn-37Pb solder joints in flip chip technology

    • Yu-Ching Hsu
    • Jenq-Gong Duh

    Regular Issue Paper Pages: 2164 - 2171

14. Cathodoluminescence study of micro-crack-induced stress relief for AlN films on Si(111)

    • G. Sarusi
    • O. Moshe
    • Y. Golan

    Letters Pages: L15 - L19