The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder Huann-Wu ChiangKenndy ChangJun-Yuan Chen Special Issue Paper Pages: 2074 - 2080
Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives Feng GaoTadashi TakemotoHiroshi Nishikawa Special Issue Paper Pages: 2081 - 2087
Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders M. A. DudekR. S. SidhuM. Renavikar Special Issue Paper Pages: 2088 - 2097
Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys M. HeV. L. Acoff Special Issue Paper Pages: 2098 - 2106
Nanoindentation on SnAgCu lead-free solder joints and analysis Luhua XuJohn H. L. Pang Special Issue Paper Pages: 2107 - 2115
Electromigration effect on intermetallic growth and Young’s modulus in SAC solder joint Luhua XuJohn H. L. PangK. N. Tu Special Issue Paper Pages: 2116 - 2125
Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows Zhong ChenAditya KumarM. Mona Special Issue Paper Pages: 2126 - 2134
Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates Chia-Wei HuangKwang-Lung Lin Special Issue Paper Pages: 2135 - 2141
Thickness determination of ultrathin oxide films and its application in magnetic tunnel junctions J. Joshua YangChengxiang JiAllan E. Schultz Regular Issue Paper Pages: 2142 - 2146
Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration Y. L. LinY. S. LaiC. R. Kao Regular Issue Paper Pages: 2147 - 2153
Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM=Co, Ni, and Zn) alloys Jenn-Ming SongChi-Feng HuangHsin-Yi Chuang Regular Issue Paper Pages: 2154 - 2163
Diffusion behavior of Cu in Cu/electroless Ni and Cu/electroless Ni/Sn-37Pb solder joints in flip chip technology Yu-Ching HsuJenq-Gong Duh Regular Issue Paper Pages: 2164 - 2171
Cathodoluminescence study of micro-crack-induced stress relief for AlN films on Si(111) G. SarusiO. MosheY. Golan Letters Pages: L15 - L19