Self-assembly of metal nanocrystals on ultrathin oxide for nonvolatile memory applications Chungho LeeJami MeteerEdwin C. Kan Regular Issue Paper Pages: 1 - 11
The effects of bath composition on the morphologies of electroless nickel under-bump metallurgy on Al input/output pad J. H. LeeI. G. LeeS. Y. Oh Regular Issue Paper Pages: 12 - 18
Uniform Cr2+ doping of physical vapor transport grown CdSxSe1−x crystals U. N. RoyO. S. BabalolaA. Burger Regular Issue Paper Pages: 19 - 22
A GeSi-buffer structure for growth of high-quality GaAs epitaxial layers on a Si substrate Edward Y. ChangTsung-Hsi YangChun-Yen Chang Regular Issue Paper Pages: 23 - 26
Electromigration-induced failure in flip-chip solder joints Y. H. LinC. M. TsaiC. R. Kao Regular Issue Paper Pages: 27 - 33
The effects of oxygen, nitrogen, and hydrogen annealing on Mg acceptors in GaN as monitored by electron paramagnetic resonance spectroscopy D. M. MatlockM. E. ZvanutAlma Wickenden Regular Issue Paper Pages: 34 - 39
Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications Hai DongKyoung-Sik MoonC. P. Wong Regular Issue Paper Pages: 40 - 45
Comparative study of interfacial reactions of Sn-Ag-Cu and Sn-Ag solders on Cu pads during reflow soldering Ahmed SharifY. C. Chan Regular Issue Paper Pages: 46 - 52
Texture investigation of copper interconnects with a different line width J. -Y. ChoK. MirpuriJ. A. Szpunar Regular Issue Paper Pages: 53 - 61
Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure Qiu-Lian ZengZhong-Guang WangJ. K. Shang Regular Issue Paper Pages: 62 - 67
The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization Guh-Yaw JangJenq-Gong Duh Regular Issue Paper Pages: 68 - 79
Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy Young-Doo JeonKyung-Wook PaikHerbert Reichl Regular Issue Paper Pages: 80 - 90
Effect of off-orientation of seed crystal on silicon carbide (SiC) single-crystal growth on the (11\(\bar 2\)0) surface0) surface Masakazu KatsunoNoboru OhtaniHirokatsu Yashiro Regular Issue Paper Pages: 91 - 95
Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Jihye LeeJung H. KimChoong D. Yoo Regular Issue Paper Pages: 96 - 102
Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders T. LaurilaV. VuorinenJ. K. Kivilahti Regular Issue Paper Pages: 103 - 111
Correlation of in-situ reflectance spectra and resistivity of GaN/Al2O3 interfacial layer in metalorganic chemical vapor deposition Yugang ZhouDeliang WangKei May Lau Regular Issue Paper Pages: 112 - 118
Effect of bismuth addition on sintering behavior and microwave dielectric properties of zinc titanate ceramics Hsun-Chin ChenMing-Hang WengYeong-Her Wang Regular Issue Paper Pages: 119 - 124