Microstructure and mechanical properties of annealed Al-1%Si bonding wire Yanqing LiuW. Kinzy Jones Regular Issue Paper Pages: 929 - 934
Thermodynamic assessment of the Sn-Co lead-free solder system Libin LiuCristina AnderssonJohan Liu Regular Issue Paper Pages: 935 - 939
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes Hsing-Fei WuMing-Jui ChiangTung-Han Chuang Regular Issue Paper Pages: 940 - 947
Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint S. -H. KimJ. -Y. KimT. Y. Lee Regular Issue Paper Pages: 948 - 957
Development of creep-resistant, nanosized Ag particle-reinforced Sn-Pb composite solders J. P. LiuF. GuoY. W. Shi Regular Issue Paper Pages: 958 - 963
Constitutive relations on creep for SnAgCuRE lead-free solder joints Zhigang ChenYaowu ShiZhidong Xia Regular Issue Paper Pages: 964 - 971
Mesa-size dependence characteristics of vertical surface-emitting lasers N. C. DasW. Chang Regular Issue Paper Pages: 972 - 976
Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications Minna ArraDongkai ShangguanEero Ristolainen Regular Issue Paper Pages: 977 - 990
Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder Paul T. ViancoJerome A. RejentPaul F. Hlava Regular Issue Paper Pages: 991 - 1004
In-situ cleaning and passivation of oxidized Cu surfaces by alkanethiols and its application to wire bonding Caroline M. WhelanMichael KinsellaKaren Maex Regular Issue Paper Pages: 1005 - 1011
High-resistivity GaSb bulk crystals grown by the vertical bridgman method R. PinoY. KoP. S. Dutta Regular Issue Paper Pages: 1012 - 1015
The electrical properties and stability of the hafnium silicate/Si0.8Ge0.2(100) interface S. AddepalliP. SivasubramaniR. M. Wallace Regular Issue Paper Pages: 1016 - 1021
Impact of carbon concentration on the interface density of states of metal-oxide Si1−x−y GexCy (strained) capacitors A. CuadrasB. GarridoT. Grabolla Regular Issue Paper Pages: 1022 - 1027
Effect of bump characteristics and temperature variation on the online contact resistance of anisotropic conductive joints Lafir AliY. C. ChanM. O. Alam Regular Issue Paper Pages: 1028 - 1035
Study of schottky barrier heights of indium-tin-oxide on p-GaN using x-ray photoelectron spectroscopy and current-voltage measurements Yow-Jon LinChou-Wei Hsu Regular Issue Paper Pages: 1036 - 1040
Characterization and modeling of static and cyclic relaxation in nonconductive adhesives M. GunawanE. H. WongT. K. Tsai Regular Issue Paper Pages: 1041 - 1047
Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints Hwa-Teng LeeMing-Hung ChenChin-Jui Hsu Regular Issue Paper Pages: 1048 - 1054