1. Foreword

   • Ashutosh Tiwari

   Special Issue Paper Pages: 1253 - 1253

2. Magnetics and magnetoresistance in epitaxial magnetite heterostructures

   • R. V. Chopdekar
   • G. Hu
   • Y. Suzuki

   Special Issue Paper Pages: 1254 - 1258

3. Magnetoresistance and magnetization studies of the layered magnanite system La_1.2Ca_1.8Mn_2−xRu_xO₇ (0 ≤ x ≤ 1)

   • Nori Sudhakar
   • K. P. Rajeev

   Special Issue Paper Pages: 1259 - 1263

4. Enhancement of ferromagnetism in the colossal-magnetoresistance layered manganite La_1.2Ba_1.8Mn_2−xRu_xO₇ (x = 0, 0.1, 0.5, and 1)

   • Nori Sudhakar
   • K. P. Rajeev
   • A. K. Nigam

   Special Issue Paper Pages: 1264 - 1268

5. A novel magnetic random access memory design using square ring elements for the hard layer

   • Dwarakanath N. Geerpuram
   • Anand S. Mani
   • Vidhya Shankar Baskaran

   Special Issue Paper Pages: 1269 - 1273

6. Probing tunnel barrier shape and its effects on inversed tunneling magnetoresistance at high bias

   • Wen-Ting Sheng
   • W. G. Wang
   • John Q. Xiao

   Special Issue Paper Pages: 1274 - 1279

7. Electrical and magnetoresistance properties of composites consisting of iron nanoparticles within the hexaferrites

   • C. Sudakar
   • T. R. N. Kutty

   Special Issue Paper Pages: 1280 - 1288

8. Mechanical alloying of FeCo Nanocrystalline magnetic powders

   • H. F. Li
   • R. V. Ramanujan

   Special Issue Paper Pages: 1289 - 1297

9. Origin of room-temperature ferromagnetism in cobalt-doped ZnO

   • S. Ramachandran
   • Ashutosh Tiwari
   • J. Narayan

   Special Issue Paper Pages: 1298 - 1302

10. Destruction of an orbitally ordered and spin-polarized state: Colossal magnetoresistance in Ca₃Ru₂O₇

    • G. Cao
    • L. Balicas
    • J. E. Crow

    Special Issue Paper Pages: 1303 - 1307

11. Etching of 4H-SiC using a NF₃ inductively coupled plasma

    • Byungwhan Kim
    • Byung-Teak Lee

    Special Issue Paper Pages: 1308 - 1312

12. The solid solubility of Ag and Cu in the Sn phase of eutectic and near-eutectic Sn-Ag-Cu solder alloys

    • L. Snugovsky
    • C. Cermignani
    • J. W. Rutter

    Special Issue Paper Pages: 1313 - 1315

13. Burnout of the organic vehicle in an electrically conductive thick-film paste

    • Zongrong Liu
    • D. D. L. Chung

    Special Issue Paper Pages: 1316 - 1325

14. Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate

    • Hai Dong
    • Kyoung-Sik Moon
    • C. P. Wong

    Special Issue Paper Pages: 1326 - 1330

15. Isotropic conductive adhesives with fusible filler particles

    • Jong-Min Kim
    • Kiyokazu Yasuda
    • Kozo Fujimoto

    Special Issue Paper Pages: 1331 - 1337

16. Partitioned viscoplastic-constitutive properties of the Pb-free Sn3.9Ag0.6Cu solder

    • Qian Zhang
    • Abhijit Dasgupta
    • Peter Haswell

    Special Issue Paper Pages: 1338 - 1349

17. Thermal gradient in solder joints under electrical-current stressing

    • T. L. Shao
    • S. H. Chiu
    • C. Y. Hsu

    Special Issue Paper Pages: 1350 - 1354

18. Effect of cooling rate on microstructure and shear strength of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-37Pb solders

    • J. G. Maveety
    • P. Liu
    • E. A. Sanchez

    Special Issue Paper Pages: 1355 - 1362

19. Microstructure and texture of free-standing Cu-line patterns

    • Karen Pantleon
    • Marcel A. J. Somers

    Special Issue Paper Pages: 1363 - 1372

20. Aging study on interfacial microstructure and solder-ball shear strength of a wafer-level chip-size package with Au/Ni metallization on a Cu pad

    • Kuo-Chin Chang
    • Kuo-Ning Chiang

    Special Issue Paper Pages: 1373 - 1380

21. Stabilizing contact resistance of isotropically conductive adhesives on various metal surfaces by incorporating sacrificial anode materials

    • Kyoung-Sik Moon
    • Silvia Liong
    • C. P. Wong

    Special Issue Paper Pages: 1381 - 1388

22. Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder—Part I: As-cast condition

    • Paul T. Vianco
    • Jerome A. Rejent
    • Alice C. Kilgo

    Special Issue Paper Pages: 1389 - 1400

23. Influence of GaN material characteristics on device performance for blue and ultraviolet light-emitting diodes

    • D. W. Merfeld
    • X. A. Cao
    • M. P. D’Evelyn

    Special Issue Paper Pages: 1401 - 1405

24. Ohmic contacts to n-type GaSb and n-type GalnAsSb

    • Robin K. Huang
    • Christine A. Wang
    • Daniel A. Shiau

    Special Issue Paper Pages: 1406 - 1410

25. Novel micro-bump fabrication for flip-chip bonding

    • Takao Ishii
    • Shinji Aoyama

    Letter Pages: L21 - L23

26. Equilibrium constants for quasi-chemical defect reactions

    • Robert F. Brebrick

    Letter Pages: L24 - L26