1. Wide and narrow bandgap semiconductors for power electronics: A new valuation

   • Jerry L. Hudgins

   Regular Issue Paper Pages: 471 - 477

2. Optimization of pretreatment for liquid-phase deposition of SiO₂ on ARTON plastic substrate

   • C. J. Huang
   • W. C. Shih

   Regular Issue Paper Pages: 478 - 482

3. Interfacial microstructure and intermetallics developed in the interface between in solders and Au/Ni/Ti thin films during reflow process

   • Keesam Shin
   • Won-Gu Cho
   • Young-Ho Kim

   Regular Issue Paper Pages: 483 - 491

4. Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices

   • A. K. Chu
   • J. Y. Lin
   • S. F. Lin

   Regular Issue Paper Pages: 492 - 495

5. Analysis of physical properties of III-nitride thin films by nanoindentation

   • Sheng-Rui Jian
   • Te-Hua Fang
   • Der-San Chuu

   Regular Issue Paper Pages: 496 - 500

6. Investigation of Ti/Al and TiN/Al thin films as the stable ohmic contact for p-type 4H-SiC

   • Byung-Teak Lee
   • Jong-Yoon Shin
   • Jong Lam Lee

   Regular Issue Paper Pages: 501 - 504

7. High resistivity measurement of SiC wafers using different techniques

   • P. G. Muzykov
   • Y. I. Khlebnikov
   • T. S. Sudarshan

   Regular Issue Paper Pages: 505 - 510

8. Electron backscattered diffraction and energy dispersive X-ray spectroscopy study of the phase NiSn₄

   • W. J. Boettinger
   • M. D. Vaudin
   • W. R. Wagner

   Regular Issue Paper Pages: 511 - 515

9. Adhesion strength of the Sn-9Zn-xAg/Cu interface

   • Tao-Chih Chang
   • Min-Hsiung Hon
   • Moo-Chin Wang

   Regular Issue Paper Pages: 516 - 522

10. Effect of dwell times on thermomechanical fatigue behavior of Sn-Ag-based solder joints

    • J. G. Lee
    • K. N. Subramanian

    Regular Issue Paper Pages: 523 - 530

11. Activation energy determination for recrystallization in electroplated-copper films using differential scanning calorimetry

    • Suresh K. Donthu
    • Mehul M. Vora
    • S. Yi

    Regular Issue Paper Pages: 531 - 534

12. Predicting tensile properties of the bulk 96.5Sn-3.5Ag lead-free solder

    • Yi-Wen Cheng
    • Thomas A. Siewert

    Regular Issue Paper Pages: 535 - 540

13. Creep rupture of lead-free Sn-3.5Ag-Cu solders

    • D. K. Joo
    • Jin Yu
    • S. W. Shin

    Regular Issue Paper Pages: 541 - 547

14. A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

    • Young-Doo Jeon
    • Sabine Nieland
    • Kyung-Wook Paik

    Regular Issue Paper Pages: 548 - 557

15. Optimization of black oxide coating thickness as an adhesion promoter for copper substrate in plastic integrated-circuit packages

    • Mohamed Lebbai
    • Jang-Kyo Kim
    • Pin Tong

    Regular Issue Paper Pages: 558 - 563

16. Effects of dimple and metal coating on interfacial adhesion in plastic packages

    • M. Lebbai
    • Jang-Kyo Kim
    • Matthew M. F. Yuen

    Regular Issue Paper Pages: 564 - 573

17. Effects of moisture and elevated temperature on reliability of interfacial adhesion in plastic packages

    • M. Lebbai
    • Jang-Kyo Kim
    • Matthew M. F. Yuen

    Regular Issue Paper Pages: 574 - 582

18. Positron-defect profiling in Cd_1−xZn_xTe wafers after saw cutting

    • Sean P. Mcneil
    • Kelvin G. Lynn
    • Raji Soundararajan

    Regular Issue Paper Pages: 583 - 585