Noise properties of linear defects in Hg1−xCdxTe I. S. VirtW. ObermayrM. Kuzma Special Issue Paper Pages: 831 - 833
The annealing of Cd1−xZnxTe in CdZn vapors Li YujieMa GuoliJie Wanqi Special Issue Paper Pages: 834 - 840
The effect of strained Al0.7In0.3As emitter layers on abrupt N-p+ AllnAs-GaInAs heterojunction diodes and heterojunction bipolar transistors Changhyun YiRobert A. MetzgerApril S. Brown Special Issue Paper Pages: 841 - 847
Fixed-angle, energy-dispersive x-ray reflectivity measurement of thin tantalum film thickness D. WindoverE. BarnatS. L. Lee Special Issue Paper Pages: 848 - 856
The effect of O2 ambient annealing on the microstructure of Cu(Mg) in the form of a Cu(Mg)/SiO2/Si multilayer W. H. LeeY. K. KoJ. G. Lee Special Issue Paper Pages: 857 - 860
The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—the effect of Ag Kang-I. ChenKwang-Lung Lin Special Issue Paper Pages: 861 - 867
Low-resistance Ti/Al ohmic contact on undoped ZnO Soo Young KimHo Won JangJong-Lam Lee Special Issue Paper Pages: 868 - 871
Interfacial transfer between copper and polyurethane in chemical-mechanical polishing Hong LiangThierry Le MogneJean-Michel Martin Special Issue Paper Pages: 872 - 878
Fatigue crack-growth behavior of Sn-Ag-Cu and Sn-Ag-Cu-Bi lead-free solders J. ZhaoY. MutohS. L. Mannan Special Issue Paper Pages: 879 - 886
Evolution of residual-inplane stress during adhesive curing and recuring in chip-on-board packages Zhiguo SunWeidong HuangLe Luo Special Issue Paper Pages: 887 - 894
The influence of thermal aging on joint strength and fracture surface of Pb/Sn and Au/Sn solders in laser diode packages M. T. SheenC. M. ChangW. H. Cheng Special Issue Paper Pages: 895 - 902