In-situ transmission electron microscopy study of the nanoindentation behavior of Al A. M. MinorE. T. LilleoddenJ. W. Morris Jr. Special Issue Paper Pages: 958 - 964
Three-dimensional monte-carlo simulation of grain growth in Pt-Co thin film Sung Il ParkSang Soo HanHyuck Mo Lee Special Issue Paper Pages: 965 - 971
Silicon solar-cell processing for minimizing the influence of impurities and defects Bhushan Sopori Special Issue Paper Pages: 972 - 980
Process optimization of polymetal (W/WN/Polysilicon) gate and its impact on dynamic random-access memory chip performance in 0.14-µm technology Pil Bo ShimJun-Ho ChoyJu Cheol Park Special Issue Paper Pages: 988 - 993
Control of chlorine inductively coupled plasma using optical-emission spectroscopy R. B. YoungT. L. ScottK. A. Prisbrey Special Issue Paper Pages: 994 - 998
Transient-enhanced diffusion in shallow-junction formation A. T. FioryS. G. ChawdaA. Agarwal Special Issue Paper Pages: 999 - 1003
Mechanism of electromigration failure in submicron Cu interconnects Nancy L. MichaelChoong-Un KimP. Gillespie Special Issue Paper Pages: 1004 - 1008
Texture enhancement of Al films on Ti underlayers by radio-frequency bias sputtering Duk-Seo ParkYoung-Ho Kim Special Issue Paper Pages: 1009 - 1015
Mechanical and tribological properties of interlayer films for the damascene-Cu chemical-mechanical planarization process A. K. SikderAshok Kumar Special Issue Paper Pages: 1016 - 1021
Pad effects on material-removal rate in chemical-mechanical planarization Ashraf BastawrosAbhijit ChandraBo Yan Special Issue Paper Pages: 1022 - 1031
Improvement of form accuracy in hybrid machining of microstructures H. S. LimA. Senthil KumarM. Rahman Special Issue Paper Pages: 1032 - 1038
A study on the grinding of glass using electrolytic in-process dressing A. Senthil KumarH. S. LimK. Fathima Special Issue Paper Pages: 1039 - 1046
Effect of copper seed aging on electroplating-induced defects in copper interconnects Daniele Contestable-GilkesDeepak RamappaSailesh M. Merchant Special Issue Paper Pages: 1047 - 1051
Reliability and early failure in Cu/oxide dual-damascene interconnects Ennis T. OgawaKi-Don LeeRobert H. Havemann Special Issue Paper Pages: 1052 - 1058
Characterization and optimization of copper chemical mechanical planarization Thomas LaursenMalcolm Grief Special Issue Paper Pages: 1059 - 1065
A model for wafer scale variation of material removal rate in chemical mechanical polishing based on viscoelastic pad deformation Guanghui FuAbhijit Chandra Special Issue Paper Pages: 1066 - 1073
Electrical and compositional properties of TaSi2 films N. M. RavindraLei JinAnthony T. Fiory Special Issue Paper Pages: 1074 - 1079
Recrystallization and intermetallic formation in Au/Al and Au/Zn bimetallic films Anil K. ChinthakindiDhananjay BhusariPaul A. Kohl Special Issue Paper Pages: 1080 - 1089
Aluminum schottky contacts to n-type 4H-SiC William R. HarrellJingyan ZhangKelvin F. Poole Special Issue Paper Pages: 1090 - 1095
Moisture absorption studies of fluorocarbon films deposited from pentafluoroethane and octafluorocyclobutane plasmas Ravindra V. TanikellaSairam AgraharamPaul A. Kohl Special Issue Paper Pages: 1096 - 1103
Flux-free direct chip attachment of solder-bump flip chip by Ar + H2 plasma treatment Soon-Min HongChoon-Sik KangJae-Pil Jung Special Issue Paper Pages: 1104 - 1111
Micro-raman study of the damage in nanopatterned GaAs(001) K. G. EyinkL. GrazulisJ. D. Busbee Special Issue Paper Pages: 1112 - 1116
Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow M. O. AlamY. C. ChanK. C. Hung Special Issue Paper Pages: 1117 - 1121
Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints Z. G. ChenY. W. ShiY. F. Yan Special Issue Paper Pages: 1122 - 1128
