1. Initial stages of GaN/GaAs (100) growth by metalorganic chemical vapor deposition

   • Dapeng Xu
   • Hui Yang
   • R. H. Wu

   Regular Issue Paper Pages: 177 - 182

2. Effects of surface porosity on tungsten trioxide(WO₃) films’ electrochromic performance

   • W. J. Lee
   • Y. K. Fang
   • Fang C. Ho

   Regular Issue Paper Pages: 183 - 187

3. Wafer bonding of 75 mm diameter GaP to AlGaInP-GaP light-emitting diode wafers

   • I. -H. Tan
   • D. A. Vanderwater
   • T. D. Ostentowski

   Regular Issue Paper Pages: 188 - 194

4. Etching behavior of GaAs/AlGaAs multilayer structure during laser beam scanning

   • Se-Ki Park
   • Cheon Lee
   • Eun Kyu Kim

   Regular Issue Paper Pages: 195 - 198

5. The removal of deformed submicron particles from silicon wafers by spin rinse and megasonics

   • Fan Zhang
   • Ahmed A. Busnaina
   • Shi-Qing Wang

   Regular Issue Paper Pages: 199 - 204

6. Effect of high-temperature annealing on GaInP/GaAs HBT structures grown by LP-MOVPE

   • F. Brunner
   • E. Richter
   • M. Weyers

   Regular Issue Paper Pages: 205 - 209

7. Phosphorus implantation into 4H-silicon carbide

   • M. A. Capano
   • R. Santhakumar
   • J. A. Cooper Jr.

   Regular Issue Paper Pages: 210 - 214

8. Electrical properties of InAlAs/InAs_xP_1-x/InP composite-channel modulation-doped structures grown by solid source molecular beam epitaxy

   • Tong-Ho Kim
   • April S. Brown
   • Robert A. Metzger

   Regular Issue Paper Pages: 215 - 221

9. Dry-etch fabrication of reduced area InGaAs/InP DHBT devices for high speed circuit applications

   • R. F. Kopf
   • R. A. Hamm
   • J. Thevin

   Regular Issue Paper Pages: 222 - 224

10. Intersubband absorption characteristics in OMVPE grown delta-doped GaAs/AlGAs multiple quantum well structures

    • Charles R. Lutz
    • Jason Kanaley
    • Kei May Lau

    Regular Issue Paper Pages: 225 - 230

11. High-temperature hysteretic electronic effects of (Al_xGa_1−x)_0.5In_0.5P (x>0.65)

    • B. Bieg
    • J. G. Cederberg
    • T. F. Kuech

    Regular Issue Paper Pages: 231 - 236

12. The adhesion strength of A lead-free solder hot-dipped on copper substrate

    • Shan-Pu Yu
    • Min-Hsiung Hon
    • Moo-Chin Wang

    Regular Issue Paper Pages: 237 - 243

13. Creep phenomena in lead-free solders

    • V. I. Igoshev
    • J. I. Kleiman

    Review paper Pages: 244 - 250