1. Foreword

   • Harish D. Merchant
   • Manfred Wuttig

   EditorialNotes Pages: 997 - 997

2. Mechanical fatigue of thin copper foil

   • H. D. Merchant
   • M. G. Minor
   • Y. L. Liu

   Special Issue Paper Pages: 998 - 1007

3. A dynamic model for solder and the problem of accelerated life testing

   • Stan Russell
   • Anne Grigals
   • Ed Clemente

   Special Issue Paper Pages: 1008 - 1016

4. The effects of underfill on the reliability of flip chip solder joints

   • Peng Su
   • Sven Rzepka
   • C. Y. Li

   Special Issue Paper Pages: 1017 - 1022

5. Mechanical properties of thin-film materials evaluated from amplitude-dependent internal friction

   • Yoichi Nishino

   Special Issue Paper Pages: 1023 - 1031

6. Internal friction of superconducting YBa₂Cu₃O_6+x wires at 200 kHz under in situ heat treatment

   • Masakuni Ozawa
   • Masahiko Inagaki
   • Suguru Suzuki

   Special Issue Paper Pages: 1032 - 1037

7. Overview of fatigue performance of Cu processed by severe plastic deformation

   • S. R. Agnew
   • A. Yu. Vinogradov
   • J. R. Weertman

   Special Issue Paper Pages: 1038 - 1044

8. Partially-constrained thermomechanical fatigue of eutectic tin-bismuth/copper solder joints

   • C. H. Raeder
   • R. W. Messler Jr.
   • L. F. Coffin Jr.

   Special Issue Paper Pages: 1045 - 1054

9. Mechanical spectroscopy of nanocrystalline metals: Structure and anelastic behavior

   • E. Bonetti
   • L. Pasquini

   Special Issue Paper Pages: 1055 - 1061

10. Influence of microstructure size on the plastic deformation kinetics, fatigue crack growth rate, and low-cycle fatigue of solder joints

    • H. Conrad
    • Z. Guo
    • Di Yang

    Special Issue Paper Pages: 1062 - 1070

11. Analysis of thermomechanical interactions in a miniature solder system under cyclic fatigue loading

    • Bor Zen Hong

    Special Issue Paper Pages: 1071 - 1077