Mechanical fatigue of thin copper foil H. D. MerchantM. G. MinorY. L. Liu Special Issue Paper Pages: 998 - 1007
A dynamic model for solder and the problem of accelerated life testing Stan RussellAnne GrigalsEd Clemente Special Issue Paper Pages: 1008 - 1016
The effects of underfill on the reliability of flip chip solder joints Peng SuSven RzepkaC. Y. Li Special Issue Paper Pages: 1017 - 1022
Mechanical properties of thin-film materials evaluated from amplitude-dependent internal friction Yoichi Nishino Special Issue Paper Pages: 1023 - 1031
Internal friction of superconducting YBa2Cu3O6+x wires at 200 kHz under in situ heat treatment Masakuni OzawaMasahiko InagakiSuguru Suzuki Special Issue Paper Pages: 1032 - 1037
Overview of fatigue performance of Cu processed by severe plastic deformation S. R. AgnewA. Yu. VinogradovJ. R. Weertman Special Issue Paper Pages: 1038 - 1044
Partially-constrained thermomechanical fatigue of eutectic tin-bismuth/copper solder joints C. H. RaederR. W. Messler Jr.L. F. Coffin Jr. Special Issue Paper Pages: 1045 - 1054
Mechanical spectroscopy of nanocrystalline metals: Structure and anelastic behavior E. BonettiL. Pasquini Special Issue Paper Pages: 1055 - 1061
Influence of microstructure size on the plastic deformation kinetics, fatigue crack growth rate, and low-cycle fatigue of solder joints H. ConradZ. GuoDi Yang Special Issue Paper Pages: 1062 - 1070
Analysis of thermomechanical interactions in a miniature solder system under cyclic fatigue loading Bor Zen Hong Special Issue Paper Pages: 1071 - 1077