Continuous hydrothermal processing of nano-crystalline particulates for chemical-mechanical planarization John G. DarabDean W. Matson Special Issue Paper Pages: 1068 - 1072
Analysis of flow between a wafer and pad during CMP processes C. RogersJ. CoppetaD. Bramono Special Issue Paper Pages: 1082 - 1087
Chemical mechanical polishing of polymer films Dan ToweryMichael A. Fury Special Issue Paper Pages: 1088 - 1094
Post-CMP cleaning using acoustic streaming Ahmed A. BusnainaT. M. Elsawy Special Issue Paper Pages: 1095 - 1098
In-process detection of microscratching during CMP using acoustic emission sensing technology Jianshe TangDavid DornfeldAlvin Dangca Special Issue Paper Pages: 1099 - 1103
Role of line-beam on the removal of particulate contaminations from solid surfaces by pulsed laser D. KumarAli AtaRajiv K. Singh Special Issue Paper Pages: 1104 - 1106
Mechanical processes in chemical-mechanical planarization: Plasticity effects in oxide thin films Krishna Rajan Special Issue Paper Pages: 1107 - 1111
Optical properties of thick-film GaN grown by hydride vapor phase epitaxy on MgAl2O4 substrate S. T. KimY. J. LeeH. Y. Park Special Issue Paper Pages: 1112 - 1116
Diffuse diffracted features and ordered domain structures in GalnP layers grown by organometallic vapor phase epitaxy Jung-Ja YangRafal SpirydonG. B. Stringfellow Special Issue Paper Pages: 1117 - 1123
Correlation between oxide breakdown and defects in SiC wafers S. SolovievI. KhlebnikovT. S. Sudarshan Special Issue Paper Pages: 1124 - 1127
Effect of reactive ion etch-induced damage on the performance of 4H-SiC schottky barrier diodes V. KhemkaT. P. ChowR. J. Gutmann Special Issue Paper Pages: 1128 - 1135
Development of InxGa1−xAs-based ohmic contacts for p-type GaAs by radio-frequency sputtering Mitsumasa OguraMasanori Murakami Letters Pages: L64 - L67
