17th International Conference on Reliability and Stress-Related Phenomena in Nanoelectronics 2023

ISSN: 0361-5235 (Print) 1543-186X (Online)

In this topical collection (3 articles)

  1. Topical Collection: Reliability and Stress-Related Phenomena in Nanoelectronics 2023

    Microcracking in On-Chip Interconnect Stacks: FEM Simulation and Concept for Fatigue Test

    Stefan Weitz, André Clausner, Ehrenfried Zschech Pages 1-9
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  2. Topical Collection: Reliability and Stress-Related Phenomena in Nanoelectronics 2023

    Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration

    Steffen Bickel, Sebastian Quednau, Olav Birlem… Pages 1-11
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  3. Topical Collection: Reliability and Stress-Related Phenomena in Nanoelectronics 2023

    A New Method for Evaluating the Influence of Coatings on the Strength and Fatigue Behavior of Flexible Glass

    Wiebke Langgemach, Edda Rädlein Pages 1-11
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