Laser-induced stress wave thermometry applied to silicon wafer processing: Modeling and experimentation G. A. RabrokerC. S. SuhR. Chona OriginalPaper Pages: 3 - 8
Study of three-dimensional deformation of a pallet using phase-shiff shadow moiré and finite-element analysis M. M. RatnamJ. H. LimH. P. S. Abdul Khalil OriginalPaper Pages: 9 - 17
Pattern evaluation for in-plane displacement measurement of thin films P. ThotaJ. LeiferJ. K. Lumpp OriginalPaper Pages: 18 - 26
Inverse method to determine elastic constants using a circular disk and moiré interferometry Z. WangJ. F. Cárdenas-GarcíaB. Han OriginalPaper Pages: 27 - 34
Prediction of bond failure and deflection of carbon fiber-reinforced plastic reinforced concrete beams A. MajiA. L. Orozco OriginalPaper Pages: 35 - 41
A new photoelastic model for studying fatigue crack closure M. N. PaceyM. N. JamesE. A. Patterson OriginalPaper Pages: 42 - 52
Mechanical characterization and modeling of polymeric materials for high-pressure sealing A. Avanzini OriginalPaper Pages: 53 - 64
Deformation measurement by phase-shifting digital holography Y. MorimotoT. NomuraI. Takahashi OriginalPaper Pages: 65 - 70
Three-dimensional point cloud registration by matching surface features with relaxation labeling method N. LiP. ChengS. R. McNeill OriginalPaper Pages: 71 - 82
Residual stress analysis near a cold expanded hole in a textured alclad sheet using X-ray diffraction J. C. P. PinaA. M. DiasP. M. S. T. de Castro OriginalPaper Pages: 83 - 88
Monitoring surface breaking defects with piezoelectric active systems S. R. K. MorikawaA. L. GamaR. R. Correia OriginalPaper Pages: 89 - 95
Full-scale, low-temperature mechanical testing of prestressing systems R. ChristenA. BergaminiK. Ghazi Wakili OriginalPaper Pages: 96 - 100
