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Review of Capabilities of the ENEPIG Surface Finish

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Abstract

Surface finishes are used to protect exposed copper metallization in printed circuit boards from oxidation and to provide a solderable surface on which to mount electronic components. While it is true that some people have called electroless nickel electroless palladium immersion gold (ENEPIG) a “universal finish” for a wide range of applications from wire bonding to solder interconnects, this paper provides a review of the current literature on ENEPIG and assesses its overall capabilities compared to other surface finishes. Gaps in understanding the performance of ENEPIG as a printed wiring board surface finish are identified and further testing is recommended.

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Acknowledgements

The authors would like to thank the more than 100 companies and organizations that support research activities at the Center for Advanced Life Cycle Engineering at the University of Maryland annually.

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Authors and Affiliations

  1. Center for Advanced Life Cycle Engineering, University of Maryland, College Park, MD, 20742, USA

    Menahem Ratzker, Adam Pearl, Michael Osterman & Michael Pecht

  2. Uyemura International Corporation, Southington, CT, 06489, USA

    George Milad

Authors
  1. Menahem Ratzker
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  2. Adam Pearl
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  3. Michael Osterman
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  4. Michael Pecht
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  5. George Milad
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Correspondence to Michael Pecht.

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Ratzker, M., Pearl, A., Osterman, M. et al. Review of Capabilities of the ENEPIG Surface Finish. J. Electron. Mater. 43, 3885–3897 (2014). https://doi.org/10.1007/s11664-014-3322-z

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  • DOI: https://doi.org/10.1007/s11664-014-3322-z

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