Abstract
A new solvent composed of 4-(tert-butyl) cyclohexyl acetate as a dilute agent and HPMDA as a thickener was developed to make micron-sized Ag paste and to bond power semiconductors. The new Ag paste achieved sentinel printing to form sharp Ag patterns with uniform thickness and defined boundaries, which is a key to printing fine pitches in the electronics industry. The electrical resistivity of Ag patterns of 3 μΩ cm was obtained at 280 °C for 30 min. Two Ag-plating copper substrates were successfully bonded with the new Ag paste and the shear strength gradually increased with the bonding temperature. A high strength of 80 MPa was achieved at 280 °C under a small sintering pressure of 0.4 MPa. This value is far higher than the value obtained by using an expensive Ag nanoparticle paste. The detailed mechanism is discussed in this work by comparison with common ethylene glycol solvent.
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References
Shenai K, Dudley M, Davis RF (2013) Current status and emerging trends in wide bandgap (WBG) semiconductor power switching devices. ECS J Solid State Sci Technol 2:N3055–N3063
Millan J (2012) A review of WBG power semiconductor devices. Semiconductor Conference (CAS), 2012 International, vol 1, 2012, p 57–66
Ryu S, Hull B, Dhar S, Cheng L, Zhang Q, Richmond J, Das M, Agarwal A, Palmour J, Lelis A, Geil B, Scozzie C (2010) Performance, reliability, and robustness of 4H-SiC power DMOSFETs. Mater Sci Forum 645–648:969–974
Burger B, Kranzer D, Stalter O (2009) Efficiency improvement of PV-inverters with SiC-DMOSFETs. Mater Sci Forum 600–603:1231–1234
Manikam VR, Kuan Yew C (2011) Die attach materials for high temperature applications: a review. IEEE Trans Compon, Packag Manuf Technol 1:457–478
Chin H, Cheong K, Ismail A (2010) A review on die attach materials for SiC-based high-temperature power devices. Metall Mater Trans B 41:824–832
Oestreicher A, Röhrich T, Wilden J, Lerch M, Jakob A, Lang H (2013) An innovative method for joining materials at low temperature using silver (nano)particles derived from [AgO2C(CH2OCH2)3H]. Appl Surf Sci 265:239–244
Wang S, Li M, Ji H, Wang C (2013) Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging. Scripta Mater 69:789–792
Oh C, Nagao S, Kunimune T, Suganuma K (2014) Pressureless wafer bonding by turning hillocks into abnormal grain growths in Ag films. Appl Phys Lett 104:161603
Moon K-S, Dong H, Maric R, Pothukuchi S, Hunt A, Li Y, Wong CP (2005) Thermal behavior of silver nanoparticles for low-temperature interconnect applications. J Electron Mater 34:168–175
Ide E, Angata S, Hirose A, Kobayashi KF (2005) Metal–metal bonding process using Ag metallo-organic nanoparticles. Acta Mater 53:2385–2393
Wang T, Chen X, Lu G-Q, Lei G-Y (2007) Low-temperature sintering with nano-silver paste in die-attached interconnection. J Electron Mater 36:1333–1340
Yi L, Kyoung-Sik M, Haiying L, Wong CP (2004) Conductivity improvement of isotropic conductive adhesives with short-chain dicarboxylic acids. 54th Proceedings on Electronic Components and Technology Conference, 2004, vol 2, p 1959–1964, vol 1952
Chun-An L, Pang L, Hong-Ching L, Sea-Fue W (2007) Characterization of the low-curing-temperature silver paste with silver 2-ethylhexanoate addition. Jpn J Appl Phys 46:251
Kim I, Chun S (2011) Effects of solvent type on low-temperature sintering of silver oxide paste to form electrically conductive silver film. J Electron Mater 40:1977–1983
Suganuma K, Sakamoto S, Kagami N, Wakuda D, Kim KS, Nogi M (2012) Low-temperature low-pressure die attach with hybrid silver particle paste. Microelectron Reliab 52:375–380
Kuramoto M, Ogawa S, Niwa M, Keun-Soo K, Suganuma K (2011) New silver paste for die-attaching ceramic light-emitting diode packages. IEEE Trans Compon, Packag Manuf Technol 1:653–659
Sakamoto S, Nagao S, Suganuma K (2013) Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices. J Mater Sci 24:2593–2601. doi:10.1007/s10854-013-1138-x
Greer JR, Street RA (2007) Thermal cure effects on electrical performance of nanoparticle silver inks. Acta Mater 55:6345–6349
Shen W, Zhang X, Huang Q, Xu Q, Song W (2014) Preparation of solid silver nanoparticles for inkjet printed flexible electronics with high conductivity. Nanoscale 6:1622–1628
Toisawa K, Hayashi Y, Takizawa H (2010) Synthesis of highly concentrated Ag nanoparticles in a heterogeneous solid-liquid system under ultrasonic irradiation. Mater Trans 51:1764–1768
Claus P, Hofmeister H (1999) Electron microscopy and catalytic study of silver catalysts: structure sensitivity of the hydrogenation of crotonaldehyde. J Phys Chem B 103:2766–2775
Liu M, Wang H, Zeng H, Li C-J (2015) Silver(I) as a widely applicable, homogeneous catalyst for aerobic oxidation of aldehydes toward carboxylic acids in water—“silver mirror”: from stoichiometric to catalytic. Sci Adv 1:e1500020
Jiu J, Zhang H, Koga S, Nagao S, Izumi Y, Suganuma K (2015) Simultaneous synthesis of nano and micro-Ag particles and their application as a die-attachment material. J Mater Sci: Mater Electron 26:7183–7191. doi:10.1007/s10854-015-3343-2
Majeed Khan MA, Kumar S, Ahamed M, Alrokayan SA, AlSalhi MS (2011) Structural and thermal studies of silver nanoparticles and electrical transport study of their thin films. Nanoscale Res Lett 6:434
Yan J, Zou G, Wu A-P, Ren J, Yan J, Hu A, Zhou Y (2012) Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging. Scripta Mater 66:582–585
Acknowledgements
This work was partly supported by the COI Stream Project, and Grant-in-Aid for Scientific Research (Kaken S, 24226017). H. Zhang acknowledges the financial support from China Scholarship Council for his PhD research in Osaka University.
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Jiu, J., Zhang, H., Nagao, S. et al. Die-attaching silver paste based on a novel solvent for high-power semiconductor devices. J Mater Sci 51, 3422–3430 (2016). https://doi.org/10.1007/s10853-015-9659-8
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DOI: https://doi.org/10.1007/s10853-015-9659-8