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Depth-sensing nanoindentation measurement techniques and applications

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Abstract

To measure nanomechanical properties of surface layers of bulk materials and thin films, depth-sensing nanoindentation measurement techniques are used commonly. The nanoindentation apparatus continuously monitors the load and the position of the indenter relative to the surface of the specimen (depth of an indent or displacement) during the indentation process. Indentation experiments can be performed at a penetration depth of as low as about 5 nm. This paper presents an overview of various nanoindentation techniques, various measurement options, and data analysis. Data on elastic–plastic deformation behavior, hardness, elastic modulus, scratch resistance, film-substrate adhesion, residual stresses, time-dependent creep and relaxation properties, fracture toughness, and fatigue are presented.

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Fig. 1
Fig. 2

(adapted from Keysight brochures)

Fig. 3

(adapted from Bhushan et al. 1996a)

Fig. 4
Fig. 5

(adapted from Bhushan and Li 2003)

Fig. 6
Fig. 7

(adapted from Oliver and Pharr 1992)

Fig. 8

(adapted from Shih et al. 1991)

Fig. 9

(adapted from Doerner and Nix 1986)

Fig. 10

(adapted from Doerner and Nix 1986)

Fig. 11

(adapted from Oliver and Pharr 1992)

Fig. 12

(adapted from Oliver and Pharr 1992)

Fig. 13
Fig. 14

(adapted from Bhushan and Li 2003)

Fig. 15

(adapted from Palacio et al. 2007b)

Fig. 16

(adapted from Bhattacharya and Nix 1988b)

Fig. 17

(adapted from King 1987)

Fig. 18

(adapted from Oliver and Pharr 1992)

Fig. 19

(adapted from Oliver and Pharr 1992)

Fig. 20

(adapted from Pharr 1992)

Fig. 21

(adapted from Pharr 1992)

Fig. 22

(adapted from Pharr 1992)

Fig. 23

(adapted from Weihs et al. 1992)

Fig. 24

(adapted from Weihs et al. 1992)

Fig. 25

(adapted from Kulkarni and Bhushan 1997)

Fig. 26

(adapted from Fabes et al. 1992)

Fig. 27

(adapted from Oliver and Pharr 1992)

Fig. 28

(adapted from Bhushan and Gupta 1995)

Fig. 29

(adapted from Bhushan et al. 1996a)

Fig. 30

(adapted from Bhushan et al. 1996a)

Fig. 31

(adapted from Kulkarni and Bhushan 1996b)

Fig. 32

(adapted from Kulkarni and Bhushan 1996b)

Fig. 33

(adapted from Bhushan et al. 1996a)

Fig. 34

(adapted from Oliver and Pharr 1992)

Fig. 35

(adapted from Li and Bhushan 2002a)

Fig. 36

(adapted from Li and Bhushan 2002a)

Fig. 37

(adapted from Li and Bhushan 2002a)

Fig. 38

(adapted from Maharaj and Bhushan 2015)

Fig. 39

(adapted from Maharaj and Bhushan 2015)

Fig. 40

(adapted from Maharaj and Bhushan 2015)

Fig. 41

(adapted from Maharaj and Bhushan 2015)

Fig. 42

(adapted from San Juan et al. 2009)

Fig. 43
Fig. 44

(adapted from Bhushan and Gupta 1995)

Fig. 45

(adapted from Li and Bhushan 1999a)

Fig. 46

(adapted from Li and Bhushan 1999a)

Fig. 47

(adapted from Li and Bhushan 1999a, 2011, 2017)

Fig. 48

(adapted from Bhushan and Li 2003)

Fig. 49
Fig. 50
Fig. 51

(adapted from Bhushan et al. 1996b)

Fig. 52

(adapted from Pharr et al. 1993)

Fig. 53

(adapted from Li et al. 1997)

Fig. 54

(adapted from Li et al. 1997)

Fig. 55

(adapted from Li and Bhushan 2002b)

Fig. 56

(adapted from Li and Bhushan 2002b)

Fig. 57

(adapted from Li and Bhushan 2002b)

Fig. 58

(adapted from Li and Bhushan 2002b)

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Abbreviations

A:

Contact area

c:

Crack length

C:

Compliance

E:

Elastic modulus

Er, Es, Ei :

Reduced modulus and elastic moduli of the specimen and indenter, respectively

h:

Indentation (penetration) depth

hc :

Contact depth

hp :

Plastic indentation depth

HB:

Indentation hardness

KI :

Stress intensity factor

KIc :

Fracture toughness

S:

Stiffness (1/compliance)

W:

Normal load

σy :

Yield strength

τ:

Adhesion strength

νs and νi :

Poisson’s ratio of the specimen and the indenter, respectively

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  1. Nanoprobe Laboratory for Bio- and Nanotechnology and Biomimetics, The Ohio State University, 201 W. 19th Ave, W390 Scott Laboratory, Columbus, OH, 43210, USA

    Bharat Bhushan

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Bhushan, B. Depth-sensing nanoindentation measurement techniques and applications. Microsyst Technol 23, 1595–1649 (2017). https://doi.org/10.1007/s00542-017-3372-2

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