Abstract
Microstructure is an important factor influencing the reliability of thin film interconnects. The microstructure of copper films is of particular interest because of its use in numerous electronic applications. Pole figure x-ray diffraction and transmission electron microcopy were conducted on copper films deposited by several techniques: sputtering, partially ionized beam deposition, chemical vapor deposition, evaporation, and electroplating. Quantitative texture data are determined from fiber texture plots. A typical copper film consists of three texture components: (111), (200), and random. (220) and (511) texture components are possible under some deposition conditions. Compared to aluminum films, the fraction of the random texture component and the distribution of the (hkl) components in copper films are relatively large. Bimodal grain size distributions are observed in some films.
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References
Microelectronic Packaging Handbook, eds. R.R. Tummula and E.J. Rymaszewski (Van Nostrand Reinhold, New York, 1989).
T. Ohmi and K. Tsubouchi,Solid State Techn. April 1992, 47.
H.-K. Kang, J.S.H. Cho and S.S. Wong,IEEE Electron Device Lett. 13, 448 (1992).
P.A. Flinn,J. Mater. Res. 6, 1498 (1991).
R.W. Herztberg,Deformation and Fracture Mechanics of Eng. Mater., 3rd ed. (John Wiley & Sons, New York, 1989), p. 15.
F.W. Young, J.V. Cathcart and A.T. Gwathmey,Ada Metal. 4, 145 (1956).
C.-A. Chang,J. Appl. Phys. 67, 566 (1990).
D.B. Knorr and K.P. Rodbell, to be published,Submicron Metallization: The Challenges, Opportunities, and Limitations (SPIE Proc, 1993).
A. Gangulee,J. Appl. Phys. 43, 867 (1972).
D.B. Knorr and T.-M. Lu,Textures and Microstructures 13, 155 (1991).
J. Li, J.W. Mayer and E.G. Colgan,J. Appl. Phys. 70, 2820 (1991).
R. Junginger and G. Eisner,J. Electrochem. Soc. 135, 2304 (1988).
S.-N. Mei and T.-M. Lu,J. Vac. Sci. Technol. A6, 9 (1988).
H.J. Bunge and K.-H. Puch,Z. Metallke. 75, 124 (1984).
L.G. Schultz,J. Appl. Phys. 20, 1030 (1949).
W.P. Chernock and P.A. Beck,J. Appl. Phys. 23, 341 (1952).
H.J. Bunge,Texture Analysis in Mater. Sci. (Butterworths, London, 1982).
J.S. Kallend, U.F. Kocks, A.D. Rollett and H.-R. Wenk,Mater. Sci. Eng. A132, 1 (1991).
N.J. Nelson, P.A. Martens, J.F. Battery, H.-R. Wenk and Z.Q. Zhong,Eighth Int. Conf. on Textures of Mater., eds. J.S. Kallend and G. Gottstein (The Metallurgical Society, 1988), p. 933.
S. Vaidya and A.K. Sinha.Thin Solid Films 75, 253 (1981).
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Tracy, D.P., Knorr, D.B. Texture and microstructure of thin copper films. J. Electron. Mater. 22, 611–616 (1993). https://doi.org/10.1007/BF02666406
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DOI: https://doi.org/10.1007/BF02666406