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Analyzing Thermal Stress Distribution in Metallic Components Using Digital Holography

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Progress in Optomechatronics

Part of the book series: Springer Proceedings in Physics ((SPPHY,volume 249))

Abstract

In present work, thermal stress distribution of a structure made of dissimilar metals is studied and analyzed using digital holographic non-destructive testing (DHNDT) method. The test structure is a press fit assembly in which a circular disk of Aluminium is tightly fitted inside a ring of mild steel material. Digital holograms of the metal structure under test are recorded in its thermally loaded and unloaded states. Amplitude and phase distribution of thermal deformation resulted from temperature gradient and different coefficient of thermal expansion (CTE) of metals, are analyzed. Thermal stress distribution generated due to thermal deformation along the surface of metal structure is also discussed. These results could be utilized in analysing thermal stress distribution in several manufacturing applications like aviation and automobile industries where these types of metal and non-metal structures are common.

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Acknowledgements

Authors are thankful to Mr. Omendra Singh of CSIR-CSIO for help in preparing the test sample. Authors also thank Department of Science and Technology, New Delhi, Government of India, for financial support for the work under HoloCam project (Grant No. DST/TSG/NTS/2015/59).

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Authors and Affiliations

  1. CSIR-Central Scientific Instruments Organisation, Chandigarh, 160030, India

    Gaurav Dwivedi & Raj Kumar

  2. Academy of Scientific & Innovative Research (AcSIR), CSIR-CSIO, Chandigarh, 160030, India

    Gaurav Dwivedi & Raj Kumar

Authors
  1. Gaurav Dwivedi
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  2. Raj Kumar
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Corresponding author

Correspondence to Raj Kumar .

Editor information

Editors and Affiliations

  1. University of Calcutta, Kolkata, West Bengal, India

    Indrani Bhattacharya

  2. Center for Optical Research and Education, Utsunomiya University, Utsunomiya, Tochigi, Japan

    Yukitoshi Otani

  3. FEMTO-ST, The Université de Franche-Comté, Besancon, France

    Philippe Lutz

  4. Goa University, Goa, India

    Sudhir Cherukulappurath

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Dwivedi, G., Kumar, R. (2020). Analyzing Thermal Stress Distribution in Metallic Components Using Digital Holography. In: Bhattacharya, I., Otani, Y., Lutz, P., Cherukulappurath, S. (eds) Progress in Optomechatronics. Springer Proceedings in Physics, vol 249. Springer, Singapore. https://doi.org/10.1007/978-981-15-6467-3_7

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  • DOI: https://doi.org/10.1007/978-981-15-6467-3_7

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-15-6466-6

  • Online ISBN: 978-981-15-6467-3

  • eBook Packages: Physics and AstronomyPhysics and Astronomy (R0)

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