Abstract
A method for using metalized holes in thin sheet composite materials of printed circuit boards for measuring thermomechanical stresses in the transverse direction relative to the stiffening sides is described. It was found that each 1% hole metalization strain corresponds to a 2% resistance change in this metallization. The results of studies are presented as applied to the materials of the bases of printed circuit boards, which are widely used in electronics, in particular, in avionics.
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Original Russian Text © A.M. Medvedev, 2016, published in Pribory i Tekhnika Eksperimenta, 2016, No. 6, pp. 110–113.
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Medvedev, A.M. A metalized-hole PCB as a strain gauge. Instrum Exp Tech 59, 879–881 (2016). https://doi.org/10.1134/S0020441216060051
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DOI: https://doi.org/10.1134/S0020441216060051