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A Novel Multiphase Sn-Sb-Cu Alloy Electrodeposited on 3D Interconnected Microporous Cu Current Collector as Negative Electrode for Lithium Ion Battery

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Metallurgical and Materials Transactions E

Abstract

We report a novel, active-active-inactive-type tin-antimony-copper alloy with dendritic morphology electrodeposited on 3D interconnected microporous copper foam (~70 μm pore diameter) as a promising high specific capacity anode for Li-ion batteries. The multiphase composition, SnSb and Cu6Sn5 “reactant” intermetallics embedded in Sn “matrix,” alleviates the volumetric stress generated during cycling by lithiating at different step potentials (0.84, 0.66, 0.57, 0.42, 0.39, and 0.38 to 0.33 V vs Li/Li+). Copper foam successfully acts as a stress buffer preventing both pulverization and delamination. This combination of properties in tin-antimony-copper anode on copper foam results in 2nd cycle discharge capacity of 723 mAh/g, superior rate capability, and stable cycle retention with a capacity loss of 16 pct in the last 70 cycles at a rate of 400 mA/g (0.5 C) while preserving its structural integrity in comparison to tin-antimony-copper anode deposited on a planar copper foil as a current collector.

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Correspondence to Siddhartha Das.

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Manuscript submitted November 9. 2016.

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Sengupta, S., Patra, A., Deo, Y. et al. A Novel Multiphase Sn-Sb-Cu Alloy Electrodeposited on 3D Interconnected Microporous Cu Current Collector as Negative Electrode for Lithium Ion Battery. Metallurgical and Materials Transactions E 4, 51–59 (2017). https://doi.org/10.1007/s40553-017-0106-4

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  • DOI: https://doi.org/10.1007/s40553-017-0106-4

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