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Analysis of adhesion strength of laminated copper layers in roll-to-roll lamination process

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Abstract

The roll-to-roll (R2R) lamination process is a promising technology for the fabrication of flexible electronic devices on large areas such as solar cells or organic light emitting diodes. In this study, mechanical factors in the R2R lamination process that affect the adhesion strength of laminated composite were studied by finite-element simulation based on a theoretical model. Moreover, the effect of mechanical factors on the attenuation of adhesion strength was evaluated by using a full factorial design of experiment. The results show that the adhesive strength of the laminated composite decreases as the operating tension and strain rate increase. However, the radius of the roller has the opposite tendency to the operating tension. Non-linear regression model was developed to express the adhesion strength according to the mechanical factors, followed by the determination of their ranges to minimize peel-off. The suggested analysis method, devices and non-linear regression model could be used as a guideline to pre-determine the operating conditions in the R2R lamination process before manufacturing laminated composites.

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Authors and Affiliations

  1. Department of Mechanical Design and Production Engineering, Konkuk University, 120, Neungdong-ro, Gwangjin-gu, Seoul, 143-701, South Korea

    Jongsu Lee, Sungsik Park & Janghoon Park

  2. Center for Advanced Electric Applications, Wonkwang University, 460, Iksan-daero, Iksan-si, Jeollabuk-do, 570-749, South Korea

    Young Seek Cho

  3. School of Mechanical Engineering, Konkuk University, 120, Neungdong-ro, Gwangjin-gu, Seoul, 143-701, South Korea

    Kee-Hyun Shin & Dongjin Lee

  4. Flexible Display Roll-to-Roll Research Center, Konkuk University, 120, Neungdong-ro, Gwangjin-gu, Seoul, 143-701, South Korea

    Kee-Hyun Shin & Dongjin Lee

Authors
  1. Jongsu Lee
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  2. Sungsik Park
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  3. Janghoon Park
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  4. Young Seek Cho
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  5. Kee-Hyun Shin
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  6. Dongjin Lee
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Correspondence to Dongjin Lee.

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Lee, J., Park, S., Park, J. et al. Analysis of adhesion strength of laminated copper layers in roll-to-roll lamination process. Int. J. Precis. Eng. Manuf. 16, 2013–2020 (2015). https://doi.org/10.1007/s12541-015-0262-3

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  • DOI: https://doi.org/10.1007/s12541-015-0262-3

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