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Plasma-Sprayed Thermal Barrier Coatings with Enhanced Splat Bonding for CMAS and Corrosion Protection

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Abstract

The infiltration of molten CMAS in thermal barrier coatings (TBCs) at high temperature is significantly affected by the microstructure of the ceramic coating. Enhancing the bonding ratio between splats can reduce the interconnected pores and suppress the infiltration of the molten CMAS into the coating. In this study, a dual-layered (DL) TBC with the dense 8YSZ on the top of the conventional porous 8YSZ was proposed to enhance CMAS corrosion of atmospheric plasma-sprayed YSZ. The dense YSZ coating with improved lamellar bonding was deposited at a higher deposition temperature. The microstructure of the coatings before and after CMAS attack test was characterized by scanning electron microscopy. It was clearly revealed that by adjusting the microstructure and applying a dense ceramic layer with the improved interface bonding on the top of porous TBC, the infiltration of CMAS into porous YSZ coating can be effectively suppressed. Moreover, by designing DL TBCs, the thermal conductivity of the TBC system exhibits a limited increase. Thus with the design of DL structure, the TBCs with high CMAS corrosion resistance and low thermal conductivity can be achieved.

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Acknowledgments

The present project is supported by the National Basic Research Program (Grant No. 2012CB625100) and National Natural Science Foundation (Grant No. 51171144). The authors are grateful for the support of the European Program Marie Curie IPACTS (No. 268696).

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Authors and Affiliations

  1. State Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi’an Jiaotong University, Xi’an, China

    Tao Liu, Shu-Wei Yao, Li-Shuang Wang, Guan-Jun Yang, Cheng-Xin Li & Chang-Jiu Li

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  1. Tao Liu
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Correspondence to Chang-Jiu Li.

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Liu, T., Yao, SW., Wang, LS. et al. Plasma-Sprayed Thermal Barrier Coatings with Enhanced Splat Bonding for CMAS and Corrosion Protection. J Therm Spray Tech 25, 213–221 (2016). https://doi.org/10.1007/s11666-015-0345-9

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  • DOI: https://doi.org/10.1007/s11666-015-0345-9

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