Abstract
Experimental data on behavior of the Sn-3.5Ag solder alloy microstructure during tensile creep deformation and subsequent failure is described. Depending upon applied stress, the nucleation and further development of grain boundary defects that start at an earlier stage in the deformation process was revealed. A discussion is presented on possible micromechanisms of the crack formation process.
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References
J. Glazer, Int. Mater. Rev. 40 (2), 65 (1995).
V.I. Igoshev and J.I. Kleiman, Creep Phenomena in Lead-Free Solders, submitted to publication.
R. Darveaux and K. Banerji, IEEE Trans. Components, Hybrids, and Manufacturing Technol. 15 (6), 1013 (1992).
W. Yang, R.W. Messler, Jr. and L.E. Felton, J. Electron. Mater. 24 (10), 1465 (1995).
S.M. Lee, Jpn. J. Appl. Phys. Part 1, 35 (7), 3999 (1996).
W. Yang, R.W. Messler, Jr. and L.E. Felton, J. Electron. Mater. 23 (8), 765 (1994).
J. Friedel, Dislocations, (Oxford: Pergamon Press, 1964), p. 620.
C. Kaynak, A. Ankara and T.J. Baker, Mater. Sci. Technol. 12, 421 (1996).
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Igoshev, V.I., Kleiman, J.I., Shangguan, D. et al. Microstructure changes in Sn-3.5Ag solder alloy during creep. J. Electron. Mater. 27, 1367–1371 (1998). https://doi.org/10.1007/s11664-998-0099-y
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DOI: https://doi.org/10.1007/s11664-998-0099-y