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Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature

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Abstract

In situ tensile tests on Sn-3.5Ag lead-free solder were performed with different rates of 10 μm/s and 300 μm/s at − 198 °C liquid nitrogen temperature. Microstructure evolution and deformation behavior of Sn-3.5Ag solder were observed by optical metallographic microscopy. The morphological influence of the second-phase particles Ag3Sn on fracture behaviors was investigated by scanning electron microscopy. The results showed that plastic deformation occurred at the low tensile rate, while no fracture toughness was observed at the high tensile rate. Several fracture modes were observed, including intergranular fracture and transgranular fracture. The morphology and distribution of the second-phase particles had a significant impact on the fracture behavior of solder. The long rod-shaped second-phase particles perpendicular to the tensile direction were difficult to fracture, while the parallel second-phase particles were broken into segments. The smaller second-phase particles barely deformed, and the voids nearby provided a favorable pathway for fracture.

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Acknowledgments

This work was supported by the National Natural Science Foundation of China (Grant No. U2241223), Fundamental Research Funds for the Central Universities (2022FRFK060019) and Heilongjiang Touyan Innovation Team Program (HITTY-20190013).

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Authors and Affiliations

  1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China

    Xiangxi Zhao, Wei Zhang, Wei Liu, Chunjin Hang & Yanhong Tian

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  1. Xiangxi Zhao
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  2. Wei Zhang
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Correspondence to Wei Zhang or Yanhong Tian.

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Zhao, X., Zhang, W., Liu, W. et al. Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature. J. of Materi Eng and Perform (2023). https://doi.org/10.1007/s11665-023-08532-x

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