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Interfacial Reactions in the Ni/Sn-xZn/Cu Sandwich Couples

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Abstract

The interfacial reactions in Ni/Sn-xZn/Cu sandwich couples which were reflowed at 270°C for 1 h and then aged at 160°C for 1–1000 h were investigated. When the 1000-μm-thick Sn-Zn alloy reacted with Ni and Cu in this couple, the results indicated that the (Ni, Cu)3Sn4, (Ni, Cu)5Zn21, and Ni5Zn21 phases were formed at Sn-1Zn/Ni, Sn-5Zn/Ni, and Sn-9Zn/Ni interfaces for 1 h reflowing, respectively. After 1000 h aging, each intermetallic compound (IMC) was converted to (Cu, Ni, Zn)6Sn5, (Ni, Cu, Sn)5Zn21/Ni5Zn21, and Ni5Zn21 (two layers) phases in the related couples. On the Cu side, the Cu6Sn5 phase in the Sn-1Zn/Cu interface and the Cu5Zn8 phase in the Sn-5Zn/Cu and Sn-9Zn/Cu interfaces were observed when the couple was reflowed at 270°C for 1 h. After 100 h aging, the (Cu, Ni, Zn)6Sn5, Cu5Zn8/(Cu, Zn)6Sn5, and Cu5Zn8 phases were formed at the Sn-1Zn/Cu, Sn-5Zn/Cu and Sn-9Zn/Cu interfaces. When the Sn-Zn alloy thickness was decreased to 500 μm, the (Cu, Ni, Zn)6Sn5 phase at the Sn-1Zn/Ni interface and the (Ni, Cu, Sn)5Zn21 phase at the Sn-5Zn/Ni and Sn-9Zn/Ni interfaces were observed after 1 h reflowing. When the couple was aged at 160°C for 1000 h, each IMC was converted to (Cu, Ni, Zn)6Sn5 and Cu5Zn8/(Cu, Ni, Sn)Zn/Ni5Zn21 phases at the Sn-1Zn/Ni and Sn-(5, 9)Zn/Ni interfaces. (Cu, Ni, Zn)6Sn5 and Cu5Zn8 were, respectively, formed at the Sn-1Zn/Cu and Sn-(5, 9)Zn/Cu interfaces for 1 h reflowing. After 100 h aging, the IMCs were converted to (Cu, Ni, Zn)6Sn5 and Cu5Zn8/(Cu, Zn)6Sn5 phases. This current study reveals that the IMC formation in Ni/(Sn-xZn)/Cu sandwich couples are very sensitive to the Zn concentration and thickness in Sn-xZn alloys.

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Acknowledgements

The authors acknowledge financial support from the Ministry of Education (MoE) Top University Projects. The author is also grateful for the help from Mr. S. C. Laiw who works at the National Taiwan University of Science and Technology for FESEM-EDS operation and analysis.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei, 106, Taiwan, Roc

    Yee-Wen Yen, Mei-Ting Lai & Wan-Ching Chen

  2. Chemical Engineering Division, Institute of Nuclear Energy Research, Taoyuan, 32546, Taiwan, Roc

    Chung-Yung Lin

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  1. Yee-Wen Yen
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  2. Chung-Yung Lin
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  4. Wan-Ching Chen
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Correspondence to Yee-Wen Yen.

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Yen, YW., Lin, CY., Lai, MT. et al. Interfacial Reactions in the Ni/Sn-xZn/Cu Sandwich Couples. J. Electron. Mater. 45, 203–211 (2016). https://doi.org/10.1007/s11664-015-4220-8

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  • DOI: https://doi.org/10.1007/s11664-015-4220-8

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